Rapid formation of Ni₃Sn₄ joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process

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• 作者：Z.L. Li^a ; H.J. Dong^a ; X.G. Song^a ; ^b ; ^{xgsong@hitwh.edu.cn} ; H.Y. Zhao^a ; ^b ; J.C. Feng^a ; ^b ; J.H. Liu^a ; H. Tian^a ; S.J. Wang^a
• 关键词：Ultrasonic soldering ; TLP bonding ; Ni3Sn4 joints ; Grain morphology ; Orientation relationship ; EBSD
• 刊名：Ultrasonics Sonochemistry
• 出版年：2017
• 出版时间：May 2017
• 年：2017
• 卷：36
• 期：Complete
• 页码：420-426
• 全文大小：2266 K
• 卷排序：36

文摘

Ni3Sn4 joints were formed using an ultrasound-induced TLP bonding process within 8s. The sonochemical effects on the mechanism and kinetics of rapid growth of Ni3Sn4 IMCs were investigated. The morphology and orientation relationship of the Ni3Sn4 grains were investigated. The role of the morphologies of Ni3Sn4 grains in the shear strengths of joints was investigated.