Numerical and experimental analysis of cooling performance of single-phase array microchannel heat sinks with different pin-fin configurations

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• 作者：Dawei Yang ; Yan Wang ; ^{wyyw@sjtu.edu.cn} ; Guifu Ding ; Zhiyu Jin ; Junhong Zhao ; Guilian Wang
• 关键词：Heat sink ; Pin fins ; Micro-channel ; Thermal resistance ; Pressure drop ; Uniformity of the chip&rsquo ; s top surface (UCTS)
• 刊名：Applied Thermal Engineering
• 出版年：2017
• 出版时间：5 February 2017
• 年：2017
• 卷：112
• 期：Complete
• 页码：1547-1556
• 全文大小：6611 K
• 卷排序：112

文摘

The manufacturing of heat sinks were accomplished by micromachining technology. The hexagonal one can reduce UCTS to 4.72%, which represents the best performance. Tmax of the chip’s surface shows the same trend with both simulation and experiment.