Integrated direct liquid cooled (DLC) power module with enhanced reliability for HEV/EV is developed.
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Al DLC structure gives rise to 40% reduction of weight and cost, and 50% reduction of junction to heat sink thermal resistance.
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Die lead bonding is proposed for interconnection to reduce parasitics by 50%. Advanced die and terminal attach technologies are suggested.
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The predicted lifetime of the DLC module is qualified for HEV/EV application.
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