Numerical Investigation on Microelectronic Chip Cooling Using Multiple Orifice Synthetic Jet Actuator Based on Theory Field Synergism

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• 作者：Yao Ma^a ; Zhi-Xun Xia^a ; Zhen-Bing Luo^a ; ^{luozhenbing@163.com" class="auth_mail" title="E-mail the corresponding author} ; Xiong Deng^a ; Xuan Ma^b
• 关键词：synthetic jet ; heat dissipation ; active and passive combined scheme ; Field Synergism
• 刊名：Procedia Engineering
• 出版年：2015
• 出版时间：2015
• 年：2015
• 卷：126
• 期：Complete
• 页码：602-606
• 全文大小：972 K

文摘

Synthetic jet is applied to the field of heat and mass transfer, because the periodical suck and blow enhances forced convection heat transfer. A multiple orifice synthetic jet actuator (SJA) is designed for the cooling of microelectronic chips. By using fin, it can achieve higher effectiveness of heat transfer with a combination of active and passive scheme in heat dissipation. Numerical simulation of the flow field of the multiple orifice SJA is performed to analyze the mechanism of the heat dissipation. Based on the above work, numerical simulations presenting the effects of heat dissipation with different flat-to-orifice distances are performed in this study. The theory Field Synergism of the optimization of convection heat transfer is introduced to evaluate the effects of the parameters on heat transfer by comparing the magnitude of the integral value. The results verify that the larger the integral value is, the higher the heat transfer coefficient is. And there is an optimum impinging distance at which the synergy degree between velocity field and temperature gradient field reaches its peak and the heat transfer coefficient is the highest.