Effect of Surfactant Concentration and Loading Ratio on the Electroless Plating Characteristics of Dense Pd Composite Membranes

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• 作者：Murali Pujari ; Amrita Agarwal ; Ramgopal Uppaluri ; Anil Verma
• 刊名：Industrial & Engineering Chemistry Research
• 出版年：2014
• 出版时间：February 26, 2014
• 年：2014
• 卷：53
• 期：8
• 页码：3105-3115
• 全文大小：547K
• 年卷期：v.53,no.8(February 26, 2014)
• ISSN：1520-5045

文摘

This article presents the effects of the concentration and loading ratios of a cationic surfactant (CTAB) on the performance characteristics of sonication-induced electroless plating baths for the fabrication of dense palladium composite membranes. The plating experiments were conducted with dropwise addition of reducing agent at loading ratios of 203 and 407 cm²/L, a palladium solution concentration of 0.005 M, and surfactant solution concentrations of 1鈥? CMC. A plating bath consisting of 0.005 M Pd with a surfactant concentration of 2 CMC at a loading ratio of 203 cm²/L provided a 100% dense palladium composite membrane after 8 h of sequential plating with a Pd film thickness of 11.16 渭m and a plating efficiency of 96%. The identified process can provide dense Pd/PSS composite membranes at a fabrication cost of 13.27 $/cm², which is 60% more cost-effective than the best-known SIEP process.