Room-Temperature Indentation Creep and the Mechanical Properties of Rapidly Solidified Sn-Sb-Pb-Cu Alloys

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• 作者：Mustafa Kamal ; A. El-Bediwi ; A. R. Lashin…
• 刊名：Journal of Materials Engineering and Performance
• 出版年：2016
• 出版时间：May 2016
• 年：2016
• 卷：25
• 期：5
• 页码：2084-2090
• 全文大小：989 KB
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Chemistry
  Characterization and Evaluation Materials
  Materials Science
  Tribology, Corrosion and Coatings
  Quality Control, Reliability, Safety and Risk
  Engineering Design
  
• 出版者：Springer New York
• ISSN：1544-1024
• 卷排序：25

文摘

In this paper, we study the room-temperature indentation creep and the mechanical properties of Sn-Sb-Pb-Cu alloys. Rapid solidification from melt using the melt-spinning technique is applied to prepare all the alloys. The experimental results show that the magnitude of the creep displacement increases with the increase in both time and applied load, and the stress exponent increases with the increase in the copper content in the alloys which happens primarily due to the existence of the intermetallic compounds SbSn and Cu₆Sn₅. The calculated values of the stress exponent are in the range of 2.82 to 5.16, which are in good agreement with the values reported for the Sn-Sb-Pb-Cu alloys. We have also studied and analyzed the structure, elastic modulus, and internal friction of the Sn-Sb-Pb-Cu alloys.Keywordshardnessindentation creeprapid solidificationx-ray diffraction