Bi-material assembly subjected to thermal stress: propensity to delamination assessed using interfacial compliance model

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• 作者：E. Suhir
• 刊名：Journal of Materials Science: Materials in Electronics
• 出版年：2016
• 出版时间：July 2016
• 年：2016
• 卷：27
• 期：7
• 页码：6779-6785
• 全文大小：399 KB
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Chemistry
  Optical and Electronic Materials
  Characterization and Evaluation Materials
  
• 出版者：Springer New York
• ISSN：1573-482X
• 卷排序：27

文摘

It is shown that an engineering stress model suggested about 30 years ago for the approximate evaluation of the interfacial stresses in adhesively bonded or soldered bi-material assemblies experiencing thermal loading and based on the concept of interfacial compliance can be employed also for the assessment of the assembly’s propensity to delamination. The analysis is limited to the shearing mode of failure and to the elastic stresses. A probabilistic extreme value distribution (EVD) approach can be used to consider the random nature of both the actual and the critical stress-energy-release-rates (SERR). The step-wise nature of the typical failure oriented accelerated test (FOAT) loading in the electronics reliability field (such as, e.g., temperature cycling) is addressed. The general concepts are illustrated by numerical examples.