Reliability of an ultra-fine-pitch COF flip-chip package using non-conductive paste

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• 作者：Hae-Yeon Kim ; Kyung-Eun Min ; Jun-Sik Lee ; So-Jeong Lee…
• 关键词：non ; conductive paste ; flip ; chip package ; chip ; on ; film ; ultra ; fine pitch ; reliability
• 刊名：Electronic Materials Letters
• 出版年：2016
• 出版时间：January 2016
• 年：2016
• 卷：12
• 期：1
• 页码：48-53
• 全文大小：1,335 KB
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• 作者单位：Hae-Yeon Kim (1)
  Kyung-Eun Min (2)
  Jun-Sik Lee (1)
  So-Jeong Lee (1)
  Sung-Soo Lee (3)
  Jun-Ki Kim (1)
  
  1. Welding & Joining Technology Group, Korea Institute of Industrial Technology, Incheon, 406-840, Korea
  2. Mechanical and Materials Engineering Department, Portland State University, Portland, OR, 97201, USA
  3. Research Institute Development Group, STECO Co., Ltd., Cheonan, 331-250, Korea
  
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Condensed Matter Physics
  Electronics, Microelectronics and Instrumentation
  Optical and Electronic Materials
  Thermodynamics
  Characterization and Evaluation of Materials
  
• 出版者：The Korean Institute of Metals and Materials, co-published with Springer Netherlands
• ISSN：2093-6788

文摘

Ultra-fine-pitch chip-on-film (COF) packages such as display-drive-integrated circuit (DDI) modules are manufactured through an underfill process following Au-to-Sn thermo-compression bonding. As the interconnection pitch becomes finer and is reduced to less than 25 um, however, an alternative flip-chip technology, such as non-conductive paste (NCP) bonding, is needed in place of the capillary underfill process. In this study, new NCP formulations are investigated to achieve rapid curing at a temperature high enough to form a metallic bond between the bump and the pad. An appropriate curing agent was determined through a dielectric analysis (DEA). COF samples were prepared with a DDI chip 11,772 × 924 um in size and with a 38 um-thick polyimide flexible printed circuit by both NCP bonding and thermo-compressionunderfill processes. Pressure cooker tests lasting as long as 192 h revealed that the reliability of the NCP sample against high temperatures and high humidity levels exceeded somewhat that of the underfill sample. In thermal cycling test up to 500 cycles, however, the reliability of the NCP sample was inferior to that of the underfill sample. It was considered that unbonded faults and NCP trapping at the bump-to-pad joint were responsible for the premature failure of the NCP sample under a thermal cycling condition.