Microcantilever Fracture Testing of Intermetallic Cu₃Sn in Lead-Free Solder Interconnects

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• 作者：Bastian Philippi ; Kurt Matoy ; Johannes Zechner…
• 关键词：Lead ; free solder ; Cu3Sn ; small ; scale testing ; fracture toughness
• 刊名：Journal of Electronic Materials
• 出版年：2017
• 出版时间：March 2017
• 年：2017
• 卷：46
• 期：3
• 页码：1607-1611
• 全文大小：
• 刊物类别：Chemistry and Materials Science
• 刊物主题：Optical and Electronic Materials; Characterization and Evaluation of Materials; Electronics and Microelectronics, Instrumentation; Solid State Physics;
• 出版者：Springer US
• ISSN：1543-186X
• 卷排序：46

文摘

Driven by legislation and the abolishment of harmful and hazardous lead-containing solders, lead-free replacement materials are in continuous development. Assessment of the mechanical properties of intermetallic phases such as Cu₃Sn that evolve at the interface between solder and copper metalization is crucial to predict performance and meet the high reliability demands in typical application fields of microelectronics. While representative material parameters and fracture properties are required to assess mechanical behavior, indentation-based testing produces different results depending on the sample type. In this work, focused ion beam machined cantilevers were used to unravel the impact of microstructure on the fracture behavior of Sn-Ag-Cu lead-free solder joints. Fracture testing on notched cantilevers showed brittle fracture for Cu₃Sn. Unnotched samples allowed measurement of the fracture stress, to estimate the critical defect size in unnotched Cu₃Sn microcantilevers.