Observation of the solidification microstructure of Sn3.5Ag droplets prepared by CDCA technique

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• 作者：Jin Zhao (1) (2)
  Yulai Gao (1) (2)
  Weipeng Zhang (1) (2)
  Tingting Song (1) (2)
  Qijie Zhai (2)
  
• 刊名：Journal of Materials Science: Materials in Electronics
• 出版年：2012
• 出版时间：December 2012
• 年：2012
• 卷：23
• 期：12
• 页码：2221-2228
• 全文大小：862KB
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• 作者单位：Jin Zhao (1) (2)
  Yulai Gao (1) (2)
  Weipeng Zhang (1) (2)
  Tingting Song (1) (2)
  Qijie Zhai (2)
  
  1. Laboratory for Microstructures, Shanghai University, Shangda Road 99, Shanghai, 200436, People’s Republic of China
  2. School of Materials Science and Engineering, Shanghai University, Yanchang Road 149, Shanghai, 200072, People’s Republic of China
  
• ISSN：1573-482X

文摘

The Sn3.5Ag droplets in various sizes have been prepared by the consumable-electrode direct current arc technique. The cooling rates of the droplets have been evaluated based on Newton’s cooling law and it shows that the cooling rates of the droplets increase dramatically from 6.84?×?102 to 2.52?×?105?K/s as the droplet size decreases from 830 to 43?μm. The range of cooling rate is close to that of laser soldering (up to 104?K/s). It has been found that the β-Sn dendrites are refined as the cooling rate increase, and when the cooling rate is 1.30?×?105?K/s, which corresponding to the size scale smaller than 60?μm, the dendrites nearly disappear in the droplets. In addition, it has been observed that the high cooling rate could successfully avoid the precipitation of plate-like Ag3Sn and promote the formation of nanoparticles which are desirable in practical application. These nanoparticles uniformly distribute in the Sn matrix and the average size of nanoparticles in different droplets is 46.4?nm (in 380-30?μm droplets), 57.2?nm (in 150-50?μm droplets), 60.6?nm (in 96-50?μm droplets), 63.2?nm (in 43-0?μm droplets) and 65.3?nm (in droplets of <43?μm), respectively. According to the dispersion-strengthening effect, the existence of nanoparticles would be beneficial to improve the mechanical property of the Sn3.5Ag solder alloy.