Grain boundary segregation in Al–Mn electrodeposits prepared from ionic liquid
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  • 作者:Ting-Yun Huang ; Christopher J. Marvel ; Patrick R. Cantwell…
  • 刊名:Journal of Materials Science
  • 出版年:2016
  • 出版时间:January 2016
  • 年:2016
  • 卷:51
  • 期:1
  • 页码:438-448
  • 全文大小:3,151 KB
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  • 作者单位:Ting-Yun Huang (1)
    Christopher J. Marvel (2)
    Patrick R. Cantwell (3)
    Martin P. Harmer (2)
    Christopher A. Schuh (1)

    1. Departments of Materials Science and Engineering, Massachusetts Institute of Technology, 77 Massachusetts Avenue, Cambridge, MA, 02139, USA
    2. Department of Materials Science and Engineering, Lehigh University, 27 Memorial Dr W, Bethlehem, PA, 18015, USA
    3. Department of Mechanical Engineering, Rose-Hulman Institute of Technology, 5500 Wabash Ave, Terre Haute, IN, 47803, USA
  • 刊物类别:Chemistry and Materials Science
  • 刊物主题:Chemistry
    Materials Science
    Characterization and Evaluation Materials
    Polymer Sciences
    Continuum Mechanics and Mechanics of Materials
    Crystallography
    Mechanics
  • 出版者:Springer Netherlands
  • ISSN:1573-4803
文摘
Among the various preparation methods for nanocrystalline alloys, ionic liquid electrodeposition at low temperature is of interest for its scalability and efficiency. To achieve nanostructures with stabilized structures, it is desirable to directly deposit alloys in which the grain boundaries are decorated with a segregated alloying element. Here a combination of atom-probe tomography and aberration-corrected scanning transmission electron microscopy are used to confirm that in Al–Mn nanocrystalline alloys deposited from an ionic liquid, Mn is slightly segregated at grain boundaries in the as-deposited condition. The apparent heat of grain boundary segregation is calculated to lie between 1100 and 1500 J mol−1, which aligns reasonably well with a value calculated using a Miedema-based segregation model, and which is also in line with a more refined CALPHAD-type estimation if it is assumed that the Al–Mn deposits are not fully equilibrated at the deposition temperature.
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