Mechanical property anisotropy in ultra-thick copper electrodeposits

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• 作者：N. R. Overman ; C. T. Overman ; D. J. Edwards ; E. W. Hoppe
• 刊名：Applied Physics A: Materials Science & Processing
• 出版年：2015
• 出版时间：September 2015
• 年：2015
• 卷：120
• 期：3
• 页码：1181-1187
• 全文大小：1,810 KB
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• 作者单位：N. R. Overman (1)
  C. T. Overman (1)
  D. J. Edwards (1)
  E. W. Hoppe (1)
  
  1. Pacific Northwest National Laboratory, P.O. Box 999, Richland, WA, 99352, USA
  
• 刊物类别：Physics and Astronomy
• 刊物主题：Physics
  Condensed Matter
  Optical and Electronic Materials
  Nanotechnology
  Characterization and Evaluation Materials
  Surfaces and Interfaces and Thin Films
  Operating Procedures and Materials Treatment
  
• 出版者：Springer Berlin / Heidelberg
• ISSN：1432-0630

文摘

Electroplating was used as a purification method and produced thick (3.2-2.2?mm) copper deposits of ultra-high radiopurity. Due to the extreme thickness of these electrodeposits compared to traditional electroplating, characterization is necessary to prevent costly failures and ensure device reliability. The deposition rate was carefully controlled to maintain a uniform growth front and required plating for a continuous 8?months in order to produce the 12.2-mm-thick copper specimen. Tensile testing shows the electroplated copper to exhibit significant strain hardening as would be expected with face-centered cubic materials, indicating that the material is free of significant defects and voids. Testing of eight tensile samples machined according to ASTM-E8 specifications exhibited yield strengths of 95?±?4?MPa. Hardness was measured to be 79.8?±?5.3?HV using a 200-gf load. Microstructure and deformation showed the grains to be highly aligned with respect to the growth direction, and electron backscatter diffraction showed the development of a (110) texture.