Sustained Deposition of Silver on Copper Surface From Choline Chloride Aqueous Solution

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• 作者：WANG Yu-rongZHOU YangWANG Wen-changCHEN Zhi-dong
• 会议时间：2014-04-21
• 关键词：Copper Surface ; Silver ; Sustained silver
• 作者单位：WANG Yu-rong,CHEN Zhi-dong(School of Petrochemical Engineering, Changzhou University, Changzhou 213164, China;Key Laboratory of Fine Petrochemicals of Jiangsu Province, Changzhou 213164, China)ZHOU Yang,WANG Wen-chang(School of Petrochemical Engineering, Changzhou University, Changzhou 213164, China)
• 母体文献：2014(重庆)国际表面工程论坛暨第十二届全国表面工程·电镀与精饰年会论文集
• 会议名称：2014(重庆)国际表面工程论坛暨第十二届全国表面工程·电镀与精饰年会
• 会议地点：重庆
• 主办单位：中国表面工程协会
• 语种：chi

摘要

Sustained silver (Ag) electroless deposition onto copper (Cu) surface was achieved from a simple and stable solution, which only containing silver salt, choline chloride (ChCl) and H2O, without using of catalyst and reductant.The mechanism of Ag deposition in ChCl-H2O solution was proven by ultra violet spectroscopy and cyclic voltammetry techniques.Through a study of the Ag coatings using atomic absorption spectroscopy, X-ray diffractometer and scanning electron microscope, we demonstrate that sustained deposition of Ag was achieved in ChCl-H2O solution with mole ratio higher than 1 ChCl ∶ 5 H2O and the calculated activation energy ofAg deposition was 13.0 kJ· mol-1.