摘要
研究了含量为(0wt%,0.1wt%,0.2wt%,0.5wt%)的稀土Pr对Sn-0.7Cu钎料组织及性能的影响,并采用X射线衍射仪和扫描电镜对添加Pr稀土元素前后钎料的微观组织进行了分析。结果表明:适量添加稀土Pr可以降低液态钎料表面张力,改善钎料的润湿性能、拉伸性能和蠕变性能;适量的稀土元素与Sn、Cu形成的Sn-Cu-Pr三元共晶组织减少了金属间化合物Cu_6Sn_5的生成,且其与Cu_6Sn_5呈弥散分布,对基体组织起到了细晶强化和弥散强化的作用。Pr在Sn-0.7Cu钎料中的最佳添加量为0.1wt%左右。
The effect of rare earth Pr(0wt %, 0.1wt %, 0.2wt %, 0.5wt %) on the microstructure and properties of Sn-0.7Cu solder was investigated. The microstructure of Sn-0.7 Cu brazing filler metals with and without the addition of Pr was analyzed by using X-ray diffractometer and scanning electron microscopy. The results show that proper amount of rare earth Pr can reduce the surface tension of the liquid solder, improve the wettability of the filler, tensile properties and creep properties. The Sn-Cu-Pr ternary eutectic structure formed by proper amount of rare earth elements and Sn, Cu reduces the formation of intermetallic compound Cu_6Sn_5, and they are distributed uniformly, which plays the role of fine crystal strengthening and dispersion strengthening on the matrix structure. The optimum addition of Pr in Sn-0.7Cu solder is about 0.1wt%.
引文
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