LED结温检测方法的分析
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  • 英文篇名:Study on Temperature Detection Method of LED Junction
  • 作者:文官富
  • 英文作者:WEN Guanfu;Wuhan Polytechnic;
  • 关键词:集成封装 ; 多芯片 ; LED结温 ; 正向电压 ; 脉冲电流法
  • 英文关键词:integrated packaging;;multi-chip;;LED junction temperature;;forward voltage;;pulse current method
  • 中文刊名:JCDL
  • 英文刊名:Application of IC
  • 机构:武汉职业技术学院;
  • 出版日期:2019-06-24 17:08
  • 出版单位:集成电路应用
  • 年:2019
  • 期:v.36;No.310
  • 基金:湖北省教育系统科技创新课题项目
  • 语种:中文;
  • 页:JCDL201907014
  • 页数:2
  • CN:07
  • ISSN:31-1325/TN
  • 分类号:50-51
摘要
基于大功率LED结温测量方法,研究被测LED器件注入方波电流脉冲过程中电流幅度与工作流量之间的比值。发现实际额定电流与冲脉电流比值相同。通过直接测量LED在额定工作电流下的正向结电压,并辅助温度敏感系数,就能够测得LED的结温。
        Based on the junction temperature measurement method of high power LED, the ratio of current amplitude to workflow during injection of square wave current pulse into the measured LED device is studied. It is found that the ratio of actual rated current to impulse current is the same. The junction temperature of the LED can be measured by directly measuring the forward junction voltage of the LED under the rated working current and assisting the temperature sensitivity coefficient.
引文
[1]平立.白光LED驱动综述[J].现代显示,2006(06):44-48.
    [2]刘欣铭,张广斌,陈骞.LED显示屏技术综述[J].黑龙江电力,2003(04):294-296.
    [3]陈挺,陈志忠,林亮,童玉珍,秦志新,张国义.GaN基白光LED的结温测量[J].发光学报,2006(03):407-412.
    [4]余彬海,王浩.结温与热阻制约大功率LED发展[J].发光学报,2005(06):761-766.
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