摘要
<正>介电复合材料能广泛应用于光电工程~([1])、脉冲功率系统~([2])、电荷的收集与存储~([3])、传感~([4])以及变频器~([5])等多个领域,受到了广大学者的普遍关注。聚合物基介电材料由于具有优异的柔性、易加工性能,较高的击穿强度、低损耗、成本低、重量轻等特点,在柔性器件制备方面具有得天独厚的优势。选用尼龙11(PA11)与偏氟乙烯与六氟丙烯的共聚物P(VDF-HFP),通过熔融挤出制备了全聚合物P(VDF-HFP)/PA11介电薄膜材料。采用差示扫描量热法、X射线衍射法、傅立叶变
引文
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