摘要
通过传统的电子浆料工艺制备太阳能电池正银浆料,将该银浆料经丝网印刷在晶硅太阳能电池片后烧结为银膜结构。采用场发射扫面电镜观测烧结银膜接触界面的形貌,分析银粉的粒径、形貌和玻璃粉的成分对太阳能电池正银浆料界面接触结构的影响。发现小粒径球状银粉和片状银粉制备的烧结银膜界面接触结构较好,形成较多的银微晶,当球形银粉粒径为0. 9μm时,体电阻率较低。采用0. 9μm粒径球形银粉和不同铋含量的玻璃粉优化正银浆料的配方,当玻璃粉中铋含量为68. 98%(T_g=614℃)时,烧结银膜与硅基体之间的接触结构较好,体电阻率最低。
Silver paste for silicon solar cells has been prepared by traditional electronic paste technology,which is screen printing on silicon solar cells and sintered into silver film. The interface morphology of the silver film is observed by scanning electron microscopy. Silver powder and glass frit effect on the contact interface of the front contract with silicon solar cells are studied here. It is found that the sintering performance of small particle powder in silver paste is better than that of large particle. When the particle size of spherical silver powder is 0. 9 μm,the bulk resistivity is low,and the contact structure performance is brilliant. Finally,0. 9 μm size spherical silver powders and different content of bismuth glass powder formula optimization is applied and bismuth content in the glass powder is set at 68. 98%( T_g= 614 ℃),the structure between silver film and silicon matrix proves to be excellent,and the bulk resistivity is lowest.
引文
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