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在“SpringerLink电子期刊”中，命中：15,260条，耗时：小于0.01 秒

在所有数据库中总计命中：18条

1. Atomic Flux of Cu Diffusion into Sn During Interfacial Interactions Between Cu and Sn Nanoparticles

作者： Jagjiwan Mittal ; Kwang-Lung Lin

关键词：Cu ; diffusion ; nanoscale ; Sn ; soldering

刊名：Journal of Electronic Materials

出版年：2017

2. Facile synthesis of yolk–shell Ni@void@SnO₂(Ni₃Sn₂) ternary composites via galvanic replacement/Kirkendall effect and their enhanced microwave absorption properties

作者： Biao Zhao ; Xiaoqin Guo ; Wanyu Zhao ; Jiushuai Deng ; Bingbing Fan ; Gang Shao…

关键词：yolk–shell ; Ni@void@SnO2(Ni3Sn2) ; galvanic replacement ; Kirkendall effect ; microwave absorption

刊名：Nano Research

出版年：2017

3. Preparation and characterization of Cu₂ZnSn(S,Se)₄ thin films by sulfurization of Cu-Zn-Sn-Se precursor layers

作者： Yongshin Kim ; In-Hwan Choi

关键词：Cu2ZnSn(S ; Se)4 ; Raman ; High pressure ; Composition ; Co ; evaporation

刊名：Journal of the Korean Physical Society

出版年：2017

4. Effects of Solidification Thermal Parameters on Microstructure and Mechanical Properties of Sn-Bi Solder Alloys

作者： Bismarck Luiz Silva ; Vítor Covre Evangelista da Silva…

关键词：Sn ; Bi alloys ; solidification ; microstructure ; Bi precipitates ; tensile strength ; fracture surface

刊名：Journal of Electronic Materials

出版年：2017

5. Influence of Interdiffusion in Sn Solution on Growth of Cu₃Sn and Cu₆Sn₅ Formed in Semi-infinite and Finite Cu-Sn Diffusion Couples

作者： Toshitada Shimozaki ; Je-hyun Lee ; Chan-Gyu Lee

关键词：binary system ; computational studies ; interdiffusion ; intermetallic compound ; solid solution ; solubility limit

刊名：Journal of Phase Equilibria and Diffusion

出版年：2017

6. Microcantilever Fracture Testing of Intermetallic Cu₃Sn in Lead-Free Solder Interconnects

作者： Bastian Philippi ; Kurt Matoy ; Johannes Zechner…

关键词：Lead ; free solder ; Cu3Sn ; small ; scale testing ; fracture toughness

刊名：Journal of Electronic Materials

出版年：2017

7. Length-Dependent Electromigration Behavior of Sn58Bi Solder and Critical Length of Electromigration

作者： Xu Zhao ; Mikio Muraoka ; Masumi Saka

关键词：Sn58Bi solder ; electromigration ; critical length ; back flow ; simultaneous evaluation

刊名：Journal of Electronic Materials

出版年：2017

8. Effects of Sulfur on the Properties of Sn-9Zn as Lead-Free Solder

作者： Xiuqin Wei ; Yinghui Li ; Huizhen Huang

关键词：Sn ; 9Zn ; lead ; free solder ; sulfur ; wettability ; corrosion

刊名：Journal of Electronic Materials

出版年：2017

9. Study of Critical Behavior in Amorphous Fe₈₅Sn₅Zr₁₀ Alloy Ribbon

作者： L. A. Han ; X. H. Hua ; H. Z. Zhu ; J. Yang ; H. P. Yang…

关键词：Critical behavior ; amorphous Fe85Sn5Zr10 alloy ribbon ; 3D Heisenberg model

刊名：Journal of Electronic Materials

出版年：2017

10. SESN2 correlates with advantageous prognosis in hepatocellular carcinoma

作者： Shaosen Chen ; Weigang Yan ; Weiya Lang ; Jing Yu ; Li Xu ; Xinyu Xu…

关键词：SESN2 ; qPCR ; Western blotting ; IHC ; Hepatocellular carcinoma

刊名：Diagnostic Pathology

出版年：2017

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