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Elsevier电子期刊(5)
在“
Elsevier电子期刊
”中,
命中:
5
条,耗时:小于0.01 秒
在所有数据库中总计命中:
5
条
1.
CFD modeling of pin shape effects on capillary flow during wave soldering
作者:
M.S. Abdul Aziz
a
;
M.Z. Abdullah
a
;
C.Y.
Khor
a
;
cykhor
_
1985
@
hotmail
.com"
class
="
auth
_mail
;
me
cykhor
@eng.usm.my"
class
="
auth
_mail
;
A. Jalar
b
;
F. Che Ani
b
;
c
关键词:
Volume of fluid
;
Capillary flow
;
Computational fluid dynamics
;
Wave soldering
刊名:International Journal of Heat and Mass Transfer
出版年:May, 2014
2.
Influence of solder bump arrangements on molded IC encapsulation
作者:
C.Y.
Khor
;
cykhor
_
1985
@
hotmail
.com"
class
="
auth
_mail
;
me
cykhor
@eng.usm.my"
class
="
auth
_mail
;
M.Z. Abdullah
;
Chun-Sean Lau
;
W.C. Leong
;
M.S. Abdul Aziz
刊名:Microelectronics Reliability
出版年:April, 2014
3.
Analysis of fluid/structure interaction: Influence of silicon chip thickness in moulded packaging
作者:
C.Y.
Khor
;
cykhor
_
1985
@
hotmail
.com
;
M.Z. Abdullah
刊名:Microelectronics Reliability
出版年:2013
4.
Investigation of the fluid/structure interaction phenomenon in IC packaging
作者:
C.Y.
Khor
;
cykhor
_
1985
@
hotmail
.com
;
M.Z. Abdullah
;
H.J. Tony Tan
;
W.C. Leong
;
D. Ramdan
刊名:Microelectronics Reliability
出版年:2012
5.
Study on the fluid/structure interaction at different inlet pressures in molded packaging
作者:
C.Y.
;
Khor
a
;
;
cykhor
_
1985
@
hotmail
.com
;
M.Z.
;
Abdullah
a
;
F.
;
Che Ani
b
关键词:
Fluid structure interaction (FSI)
;
Finite volume method (FVM)
;
Finite element method (FEM)
;
Molded package
刊名:Microelectronic Engineering
出版年:2011
1
按检索点细分(5)
作者(5)
按出版年细分(5)
2027年及以后(2)
2013年(1)
2012年(1)
2011年(1)
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