Elsevier电子期刊(15)
在“Elsevier电子期刊”中,命中:15条,耗时:0.1419334 秒

在所有数据库中总计命中:15

1.Current trends on ICT technologies for enterprise information systems
作者:Soumaya El Kadiria ; soumaya.elkadiri@epfl.ch" class="auth_mail" title="E-mail the corresponding authorAuthor Vitae ; Bernard Grabotb ; bernard.grabot@enit.fr" class="auth_mail" title="E-mail the corresponding authorAuthor Vitae ; Klaus-Dieter Thobenc ; tho@biba.uni-bremen.de" class="auth_mail" title="E-mail the corresponding authorAuthor Vitae ; Karl Hribernikd ; hri@biba.uni-bremen.de" class="auth_mail" title="E-mail the corresponding authorAuthor Vitae ; Christos Emmanouilidise ; chrisem@ceti.gr" class="auth_mail" title="E-mail the corresponding authorAuthor Vitae ; Gregor von Cieminskif ; gregor.cieminski@zf.com" class="auth_mail" title="E-mail the corresponding authorAuthor Vitae ; Dimitris Kiritsisa ; dimitris.kiritsis@epfl.ch" class="auth_mail" title="E-mail the corresponding authorAuthor Vitae
刊名:Computers in Industry
出版年:2016
2.Information reconciliation schemes in physical-layer security: A survey
刊名:Computer Networks
出版年:2016
3.Multi-loaded ceramic beads/matrix scaffolds obtained by combining ionotropic and freeze gelation for sustained and tuneable vancomycin release
作者:Ulrike Hessa ; uhess@uni-bremen.de" class="auth_mail" title="E-mail the corresponding authorAuthor Vitae ; Gerd Mikolajczykb ; gerd.mikolajczyk1@tu-dresden.de" class="auth_mail" title="E-mail the corresponding authorAuthor Vitae ; Laura Treccania ; 1 ; treccanilaura@gmail.com" class="auth_mail" title="E-mail the corresponding authorAuthor Vitae ; Philipp Streckbeinc ; e ; philipp.streckbein@uniklinikum-giessen.de" class="auth_mail" title="E-mail the corresponding authorAuthor Vitae ; Christian Heissd ; e ; christian.heiss@chiru.med.uni-giessen.de" class="auth_mail" title="E-mail the corresponding authorAuthor Vitae ; Stefan Odenbachb ; stefan.odenbach@tu-dresden.de" class="auth_mail" title="E-mail the corresponding authorAuthor Vitae ; Kurosch Rezwana ; f ; krezwan@uni-bremen.de" class="auth_mail" title="E-mail the corresponding authorAuthor Vitae
刊名:Materials Science & Engineering C
出版年:2016
5.Design, fabrication and embedding of microscale interdigital sensors for real-time cure monitoring during composite manufacturing
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