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Elsevier电子期刊(2)
在“
Elsevier电子期刊
”中,
命中:
2
条,耗时:0.0689665 秒
在所有数据库中总计命中:
2
条
1.
Structural and electrical characterization of CoNiO monolayer as copper diffusion barrier in integrated circuits
作者:
S. Sharma
a
;
sumitels
d2007@
gmail
.com"
class
="auth_mail"
title
="E-mail the
corresponding
author
;
M. Kumar
a
;
b
;
kumarmukseh@
gmail
.com"
class
="auth_mail"
title
="E-mail the
corresponding
author
;
S. Rani
a
;
sumitagarg2007@
gmail
.com"
class
="auth_mail"
title
="E-mail the
corresponding
author
;
D. Kumar
a
;
d
;
dineshelsd2014@
gmail
.com"
class
="auth_mail"
title
="E-mail the
corresponding
author
;
C.C. Tripathi
c
;
tripathiuiet@
gmail
.com"
class
="auth_mail"
title
="E-mail the
corresponding
author
关键词:
Langmuir Blodgett technique
;
Monolayer diffusion barrier
;
Biased thermal stress
;
XRD
;
C‒V and leakage current characterization
刊名:Materials Science in Semiconductor Processing
出版年:2016
2.
Diffusion barrier characteristics of co monolayer prepared by Langmuir Blodgett technique
作者:
Sumit Sharma
a
;
sumitels
d2007@
gmail
.com"
class
="auth_mail"
title
="E-mail the
corresponding
author
;
Mukesh Kumar
b
;
kumarmukesh@
gmail
.com"
class
="auth_mail"
title
="E-mail the
corresponding
author
;
Sumita Rani
a
;
Dinesh Kumar
a
;
dineshelsd@
gmail
.com"
class
="auth_mail"
title
="E-mail the
corresponding
author
关键词:
Langmuir Blodgett technique
;
Monolayer diffusion barrier
;
Biased thermal stress
;
XRD
;
C&ndash
;
V and leakage current characterization
刊名:Applied Surface Science
出版年:2016
1
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2016年(2)
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