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内部出版物
Wiley电子期刊(1)
SpringerLink电子期刊(6)
Elsevier电子期刊(27)
ACS电子期刊(2)
在“
Elsevier电子期刊
”中,
命中:
27
条,耗时:0.0259854 秒
在所有数据库中总计命中:
36
条
1.
Strain
-induced multiscale structural changes in lamellar thermal barrier coatings
作者:
Guang-Rong Li
;
Guan-Jun Yang
;
ygj@mail.xjtu.edu.cn
;
Cheng-Xin Li
;
Chang-Jiu Li
关键词:
Plasma spraying
;
Multiscale structural changes
;
Thermal barrier coatings
;
Mechanical properties
;
CTE
mismatch
strain
刊名:Ceramics International
出版年:2017
2.
Effects of post-treatment of meta-aramid nanofiber mats on the adhesion strength of epoxy adhesive joints
作者:
Seung Yoon On
a
;
Moo Sun Kim
b
;
Seong Su Kim
a
;
sskim@jbnu.ac.kr" class="auth_mail" title="E-mail the corresponding author
关键词:
Adhesion strength
;
Electrospun nanofiber
;
Single-lap joint
;
Nanofiber reinforcement
刊名:Composite Structures
出版年:2017
3.
Influence of die-shift-distance of overhang dies on residual thermal shear stress in 5-chip SiP after EMC curing
作者:
Wei-Hua Lu
a
;
Jhih-Hao Lin
a
;
Chuen-Shii Chou
b
;
cschou@mail.npust.edu.tw" class="auth_mail" title="E-mail the corresponding author
关键词:
Stacked-die system-in-packaging
;
Overhang die
;
Die-shift-distance
;
Shear
strain
energy density
刊名:Materials & Design
出版年:2016
4.
Thermo-mechanical simulation of PCB with embedded components
作者:
W. Kpobie
a
;
M. Martiny
a
;
S. Mercier
a
;
sebastien.mercier@univ-lorraine.fr" class="auth_mail" title="E-mail the corresponding author
;
F. Lechleiter
b
;
L. Bodin
b
;
A. Lecavelier des Etangs-Levallois
c
;
M. Brizoux
c
关键词:
Finite elements simulation
;
Printed circuit board
;
Thermo-mechanical coupling
;
Embedded components
刊名:Microelectronics Reliability
出版年:2016
5.
Influence of particle size and spatial distribution of B
4
C reinforcement on the microstructure and mechanical behavior of precipitation strengthened Al alloy matrix composites
作者:
Chuandong Wu
a
;
b
;
Kaka Ma
c
;
Jialu Wu
a
;
Pan Fang
a
;
Guoqiang Luo
a
;
luogq@whut.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Fei Chen
a
;
Qiang Shen
a
;
sqqf@263.net" class="auth_mail" title="E-mail the corresponding author
;
Lianmeng Zhang
a
;
Julie M. Schoenung
b
;
Enrique J. Lavernia
b
关键词:
Metal matrix composites
;
Reinforcement
;
Strengthening mechanism
;
Fracture mechanism
刊名:Materials Science & Engineering A
出版年:2016
6.
The effect of residual stress on mechanical resistance of ZrSiO
4
/Al
2
O
3
laminates
作者:
Mó
;
nica Leó
;
n-Carriedo
;
mony_atenea@hotmail.com" class="auth_mail" title="E-mail the corresponding author
;
monica.leon@cinvestav.edu.mx" class="auth_mail" title="E-mail the corresponding author
;
Carlos Alberto Gutié
;
rrez
;
Jorge Ló
;
pez-Cuevas
;
Martí
;
n Ignacio Pech-Canul
;
José
;
Luis Rodrí
;
guez-Galicia
关键词:
Laminates
;
Slip casting
;
Mechanical properties
;
Zircon
刊名:Boletín de la Sociedad Espa?ola de Cerámica y Vidrio
出版年:2016
7.
Multi-physics modeling for laser micro-transfer printing delamination
作者:
Ala&rsquo
;
a M. Al-okaily
alokail2@illinois.edu" class="auth_mail" title="E-mail the corresponding author
Author Vitae
;
Placid M. Ferreira
;
pferreir@illinois.edu" class="auth_mail" title="E-mail the corresponding author
;
pferreir@uiuc.edu" class="auth_mail" title="E-mail the corresponding author
Author Vitae
关键词:
Micro-transfer printing
;
Laser micro-assembly
;
Flexible electronics
;
Laser-driven delamination
;
Fracture mechanics
;
Multi-physics modeling
刊名:Journal of Manufacturing Processes
出版年:2015
8.
Mismatch
and thermal
strain
analysis in MBE-grown HgCdTe/CdZnTe
作者:
P. Ballet
;
philippe.ballet@cea.fr
;
A. Jonchè
;
re
;
B. Amstatt
;
X. Baudry
;
B. Polge
;
D. Brellier
;
P. Gergaud
关键词:
A1. X-ray diffraction
;
A3.
Strain
;
B1. MBE
;
HgCdTe
刊名:Journal of Crystal Growth
出版年:2013
9.
Elastic-plastic analysis of the steel-to-tungsten transition joint for a high performance divertor
作者:
D. Navaei
a
;
daranavaei@yahoo.com
;
X.R. Wang
a
;
xrwang@ucsd.edu
;
M.S. Tillack
a
;
mtillack@ucsd.edu
;
S. Malang
b
;
smalang@web.de
;
the ARIES Team
关键词:
Plastic
strain
;
Plate type divertor
;
Cyclic loading
;
Thermal stress
刊名:Fusion Engineering and Design
出版年:2013
10.
Joining and interface chara
cte
rization of in situ reinforced silicon nitride
作者:
R. Asthana
a
;
asthanar@uwstout.edu
;
M. Singh
b
;
Mrityunjay.Singh@nasa.gov
;
J. Martinez-Fernandez
c
;
Martinez@us.es
关键词:
Ceramics
;
Thermal expansion
;
Transmission electron microscopy
;
Nitride materials
;
Surfaces and interfaces
刊名:Journal of Alloys and Compounds
出版年:2013
1
2
3
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