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内部出版物
Wiley电子期刊(7)
NATURE电子期刊(2)
ACS电子期刊(78)
SpringerLink电子期刊(197)
Elsevier电子期刊(757)
在“
Elsevier电子期刊
”中,
命中:
757
条,耗时:0.0569721 秒
在所有数据库中总计命中:
1,041
条
1.
Properties of power electronic substrates based on thick printed
copper
technology
作者:
Jan Reboun
a
;
jreboun@ket.zcu.cz
;
Karel Hromadka
a
;
Vojtech Hermansky
a
;
Jan Johan
b
关键词:
Copper
paste
;
Thick printed
copper
technology
;
Thick
film
copper
firing
;
Copper
film
morphology
;
Copper
film
properties
;
Inert gas batch furnace
刊名:Microelectronic Engineering
出版年:2017
2.
Influence of the
morphology
of the
copper
(II) phthalocyanine thin
film
on the performance of organic field-effect transistors
作者:
Jing Xu
a
;
b
;
373003762@qq.com
;
Xueqiang Liu
c
;
Hailong Wang
a
;
Wenlong Hou
a
;
Lele Zhao
a
;
Haiquan Zhang
a
;
haiquanzhang@ysu.edu.cn
关键词:
OTFT
;
Copper
phthalocyanine
;
Solvent vapor annealing
;
Threshold voltage
;
Mobility
刊名:Solid-State Electronics
出版年:2017
3.
Influence of support electrolytic in the electrodeposition of CuGaSe thin
film
s
作者:
A.M. Fernandez
a
;
afm@ier.unam.mx
;
J.A. Turner
b
;
B. Lara-Lara
a
;
T.G. Deutsch
b
关键词:
Electrodeposition
;
Thin
film
s
;
Chalcogenide compounds
刊名:Superlattices and Microstructures
出版年:2017
4.
Corrosion of
copper
in oxygen-deficient groundwater with and without deep bedrock micro-organisms: Characterisation of microbial communities and surface processes
作者:
E. Huttunen-Saarivirta
a
;
elina.huttunen-saarivirta@vtt.fi
;
P. Rajala
a
;
M. Bomberg
b
;
L. Carpé
;
n
a
关键词:
Microbiologically influenced corrosion (MIC)
;
Copper
;
Sulphate-reducing bacteria (SRB)
;
Bio
film
;
Corrosion
刊名:Applied Surface Science
出版年:2017
5.
Tuning of superhydrophobic to hydrophilic surface: A facile one step electrochemical approach
作者:
S. Ashoka
a
;
b
;
ashok022@gmail.com
;
N. Saleema
c
;
D.K. Sarkar
b
;
dsarkar@uqac.ca
关键词:
Electrodeposition
;
Over-oxidized polypyrrole
;
Superhydrophobic
;
Contact angle hysteresis
刊名:Journal of Alloys and Compounds
出版年:2017
6.
Influence of Cu/Sn mixture on the shape and structure of crystallites in
copper
-containing
film
s: Morphological and X-ray spectroscopy studies
作者:
G.E. Yalovega
;
yalovega1968@mail.ru" class="auth_mail" title="E-mail the corresponding author
关键词:
Copper
oxide and Cu/Sn mixed oxide crystallites
;
Surface
morphology
;
Thin
film
s
;
Sol-gel technique
;
SEM
;
X-ray spectroscopy
刊名:Applied Surface Science
出版年:2016
7.
Slow oxidation kinetics in an epitaxial
copper
(1 0 0)
film
作者:
Yukta P. Timalsina
;
timaly@rpi.edu" class="auth_mail" title="E-mail the corresponding author
;
Morris Washington
;
Gwo-Ching Wang
;
Toh-Ming Lu
关键词:
X-ray photoelectron spectroscopy
;
Epitaxial
film
;
Oxidation
;
Morphology
;
Ambient
刊名:Applied Surface Science
出版年:2016
8.
Evaluation of the Electrochemical Properties of Crystalline
Copper
Antimonide Thin
Film
Anodes for Lithium Ion Batteries Produced by Single Step Electrodeposition
作者:
Everett D. Jackson
1
;
James M. Mosby
1
;
2
;
Amy L. Prieto
;
amy.prieto@colostate.edu" class="auth_mail" title="E-mail the corresponding author
关键词:
Copper
antimonide
;
Alloy anode
;
Thin
film
electrode
刊名:Electrochimica Acta
出版年:2016
9.
Morphologies and wetting properties of
copper
film
with 3D porous micro-nano hierarchical structure prepared by electrochemical deposition
作者:
Hongbin Wang
;
Ning Wang
;
Tao Hang
;
hangtao@sjtu.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Ming Li
;
mingli90@sjtu.edu.cn" class="auth_mail" title="E-mail the corresponding author
关键词:
Hierarchical structure
;
Porous
film
;
Electrochemical deposition
;
Morphology
;
Super-hydrophobicity
刊名:Applied Surface Science
出版年:2016
10.
Effect of coating current density on the wettability of electrodeposited
copper
thin
film
on aluminum substrate
作者:
Arun Augustin
;
arunmalabar@yahoo.com" class="auth_mail" title="E-mail the corresponding author
;
K. Rajendra Udupa
;
K. Udaya Bhat
关键词:
Copper
thin
film
;
SEM
;
TEM
;
Contact angle
刊名:Perspectives in Science
出版年:2016
1
2
3
4
5
6
7
8
9
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