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SpringerLink电子期刊(25)
NATURE电子期刊(1)
Elsevier电子期刊(57)
ACS电子期刊(1)
在“
Elsevier电子期刊
”中,
命中:
57
条,耗时:0.0949532 秒
在所有数据库中总计命中:
84
条
1.
Role of copper addition on properties of bulk metallic glass materials
作者:
Sidra Jilani
a
;
Sidrajilani@hotmail.com" class="auth_mail" title="E-mail the corresponding author
;
Fazal Ahmad Khalid
a
;
b
;
khalid@giki.edu.pk" class="auth_mail" title="E-mail the corresponding author
关键词:
Bulk metallic glass
;
Cu
-
added
and
Cu-
free
alloy
;
Micro Hardness
;
Super cooled liquid region
刊名:Materials Science & Engineering A
出版年:2016
2.
Impact toughness, hardness
and
shear strength of Fe
and
Bi
added
Sn-1Ag-0.5
Cu
lead-
free
solders
作者:
Bakhtiar Ali
;
Mohd Faizul Mohd Sabri
;
faizul@um.edu.my" class="auth_mail" title="E-mail the corresponding author
;
Iswadi Jauhari
;
Nazatul Liana Sukiman
关键词:
SAC105
;
Lead-
free
solder
;
Fe/Bi additives
;
Impact toughness
;
Hardness
;
Shear strength
刊名:Microelectronics Reliability
出版年:2016
3.
Microstructures
and
properties of new Sn-Ag-
Cu
lead-
free
solder reinforced with Ni-coated graphene nanosheets
作者:
Guang Chen
a
;
b
;
Fengshun Wu
a
;
fengshunwu@hust.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Changqing Liu
b
;
C.Liu@lboro.ac.uk" class="auth_mail" title="E-mail the corresponding author
;
Vadim V. Silberschmidt
b
;
Y.C. Chan
c
关键词:
Ni-coated graphene oxide
;
Lead-
free
solder
;
Wettability
;
Melting temperature
;
Mechanical properties
;
Raman spectrum
刊名:Journal of
Alloy
s
and
Compounds
出版年:2016
4.
Effect of Zn addition on the microstructure, texture evolution
and
mechanical properties of Al-Mg-Si-
Cu
alloy
s
作者:
Xiaofeng Wang
a
;
wangxiaofeng@nbu.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Mingxing Guo
b
;
mingxingguo@skl.ustb.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Jishan Zhang
b
;
Linzhong Zhuang
b
关键词:
Al-Mg-Si-
Cu
alloy
;
Mechanical property
;
Microstructure
;
Secondary phase particle
;
Texture
刊名:Materials Science & Engineering A
出版年:2016
5.
Isothermal Aging of Low-Ag SAC with Al Addition
作者:
M.K. Nur Nadhirah
;
K. Maslinda
;
M.S. Nurulakmal
;
srnurul@usm.my" class="auth_mail" title="E-mail the corresponding author
;
A.S. Anasyida
关键词:
Isothermal aging
;
low-Ag SAC
;
intermetallic compound
刊名:Procedia Chemistry
出版年:2016
6.
Microstructural modifications
and
properties of low-Ag-content Sn-Ag-
Cu
solder joints induced by Zn
alloy
ing
作者:
A.A. El-Daly
a
;
b
;
dreldaly11@yahoo.com" class="auth_mail" title="E-mail the corresponding author
;
dreldaly@zu.edu.eg" class="auth_mail" title="E-mail the corresponding author
;
H. El-Hosainy
a
;
T.A. Elmosalami
a
;
W.M. Desoky
a
关键词:
Lead-
free
solders
;
Microstructure
;
Mechanical properties
刊名:Journal of
Alloy
s
and
Compounds
出版年:2015
7.
Influence of Mo concentration on corrosion resistance to HF acid solution of Ni-Co-Cr-Mo
alloy
s with
and
without
Cu
作者:
Yuhang Hou
a
;
Yunping Li
b
;
lyping@csu.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Fenglin Wang
c
;
Chen Zhang
a
;
Yuichiro Koizumi
c
;
Akihiko Chiba
c
关键词:
Interfaces (C)
;
Alloy
(A)
;
Acid solutions (A)
;
Acid corrosion (C)
;
Cobalt (A)
;
Nickel (A)
刊名:Corrosion Science
出版年:2015
8.
Effects of Al
and
Fe additions on microstructure
and
mechanical properties of SnAg
Cu
eutectic lead-
free
solders
作者:
A. Kantarc谋o臒lu
;
Y.E. Kalay
关键词:
Lead
free
SAC
alloy
s
;
Fe
and
Al modification
;
Microstructure
;
Shear strength
刊名:Materials Science
and
Engineering: A
出版年:21 January, 2014
9.
Highly improved electrochemical hydrogen storage performances of the Nd-
Cu
-
added
Mg
2
Ni-type
alloy
s by melt spinning
作者:
Yanghuan Zhang
;
Can Li
;
Ying Cai
;
Feng Hu
;
Zhuocheng Liu
;
Shihai Guo
关键词:
Mg2Ni-type
alloy
;
Nd addition
;
Melt spinning
;
Nanocrystalline
and
amorphous
;
Electrochemical hydrogen storage performances
刊名:Journal of
Alloy
s
and
Compounds
出版年:25 January, 2014
10.
Effect of TiO
2
nanoparticle addition on electroless Ni-P under bump metallization for lead-
free
solder interconnection
作者:
Xiao Hu
a
;
Sha Xu
a
;
Ying Yang
b
;
Zhong Chen
b
;
Y.C. Chan
a
;
eeycchan@cityu.edu.hk" class="auth_mail
关键词:
Lead-
free
solder
;
Under bump metallization
;
Electroless deposition
;
Ni&ndash
;
P&ndash
;
TiO2
;
Interfacial reaction
;
Shear strength
刊名:Materials Science
and
Engineering: A
出版年:10 April, 2014
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