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内部出版物
SpringerLink电子期刊(12)
Elsevier电子期刊(15)
在“
Elsevier电子期刊
”中,
命中:
15
条,耗时:小于0.01 秒
在所有数据库中总计命中:
27
条
1.
Subsurface crack damage in silicon wafers induced by resin bonded
diamond
wire
sawing
作者:
Tengyun Liu
a
;
lty198614@163.com" class="auth_mail" title="E-mail the corresponding author
;
Peiqi Ge
a
;
b
;
pqge@sdu.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Wenbo Bi
a
;
b
;
biwenbo@sdu.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Yufei Gao
a
;
b
;
yfgao@sdu.edu.cn" class="auth_mail" title="E-mail the corresponding author
关键词:
Resin bonded
diamond
wire
saw
;
Silicon wafer
;
Subsurface crack damage
刊名:Materials Science in Semiconductor Processing
出版年:2017
2.
Wire
sawing
technology: A state-of-the-art review
作者:
Hao Wu
;
pingchina85@gmail.com" class="auth_mail" title="E-mail the corresponding author
关键词:
Wire
sawing
;
Diamond
wire
sawing
;
Modeling
;
Material removal
;
Indentation
;
Scribing
刊名:Precision Engineering
出版年:2016
3.
Effect of wear of
diamond
wire
on surface morphology, roughness and subsurface damage of silicon wafers
作者:
Arkadeep Kumar
a
;
arkadeepkumar@gatech.edu" class="auth_mail" title="E-mail the corresponding author
;
Steffi Kaminski
b
;
Shreyes N. Melkote
a
;
Chris Arcona
b
关键词:
Wear
;
Diamond
;
Wire
sawing
;
Silicon wafer
;
Surface
;
Subsurface damage
刊名:Wear
出版年:2016
4.
Effect of
Diamond
Wire
Saw Marks on Solar Cell Performance
作者:
Hubert Seigneur
a
;
b
;
c
;
Hubert.Seigneur@uspvmc.org" class="auth_mail" title="E-mail the corresponding author
;
Eric J. Schneller
a
;
b
;
Narendra S. Shiradkar
a
;
d
;
Winston V. Schoenfeld
a
;
b
;
c
关键词:
Silicon solar cell
;
Diamond
wire
saw
;
Ingot
;
Photoluminescence
;
Quantum efficiency
;
Spatially resolved loss analysis
刊名:Energy Procedia
出版年:2016
5.
Effect of
sawing
induced micro-crack orientations on fracture properties of silicon wafers
作者:
Amin S. Azar
a
;
amin.azar@sintef.no" class="auth_mail" title="E-mail the corresponding author
;
Bø
;
rge Holme
a
;
Ø
;
yvind Nielsen
b
关键词:
Abrasive
wire
sawing
;
Silicon
;
Wafer
;
Subsurface cracks
;
Fracture mechanics
刊名:Engineering Fracture Mechanics
出版年:2016
6.
Ductile Mode Behavior of Silicon During Scribing by Spherical Abrasive Particles
作者:
Arkadeep Kumar
a
;
arkadeepkumar@gatech.edu" class="auth_mail" title="E-mail the corresponding author
;
Andrii Kovalchenko
b
;
Vanessa Pogue
a
;
Evgeniy Pashchenko
c
;
Shreyes N. Melkote
a
;
shreyes.melkote@me.gatech.edu" class="auth_mail" title="E-mail the corresponding author
关键词:
Surface integrity
;
Silicon
;
Tungsten carbide
刊名:Procedia CIRP
出版年:2016
7.
Multi-
wire
sawing
of sapphire crystals with reciprocating motion of electroplated
diamond
wire
s
作者:
Hyoungjae Kim
b
;
Doyeon Kim
b
;
Chulmin Kim
b
;
Haedo Jeong
a
;
关键词:
Cutting tool
;
Wafer
;
Multi-
wire
sawing
刊名:CIRP Annals - Manufacturing Technology
出版年:2013
8.
Analysis of the Sub-surface Damage of mc- and cz-Si Wafers Sawn with
Diamond
-plated
Wire
作者:
Rajko Buchwald
;
Kilian Fr?hlich
;
Sindy W¨¹rzner
;
Toni Lehmann
;
Kirsten Sunder
;
Hans Joachim M?ller
关键词:
Diamond
wire
;
crack depth
;
crack length
;
sub-surface damage
;
fracture strength
;
fracture stress
;
roughness
;
silicon
刊名:Energy Procedia
出版年:2013
9.
Thin Czochralski silicon solar cells based on
diamond
wire
sawing
technology
作者:
Xuegong Yu
;
Peng Wang
;
Xiaoqiang Li
;
Deren Yang
;
mseyang@zju.edu.cn
关键词:
Thin silicon wafer
;
Solar cells
;
Diamond
wire
sawing
;
Mechanical strength
;
Conversion efficiency
刊名:Solar Energy Materials and Solar Cells
出版年:2012
10.
Effects of carbide and nitride inclusions on
diamond
scribing of multicrystalline silicon for solar cells
作者:
Hao Wu
;
wuhao85@gatech.edu
;
Shreyes N. Melkote
;
Steven Danyluk
关键词:
Multicrystalline silicon
;
Inclusions
;
Diamond
scribing
;
Wire
sawing
刊名:Precision Engineering
出版年:2013
1
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