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Elsevier电子期刊(7)
ACS电子期刊(1)
在“
Elsevier电子期刊
”中,
命中:
7
条,耗时:0.1219413 秒
在所有数据库中总计命中:
8
条
1.
Heat transfer enhancement of vertical
dimpled
fin
array
in natural convection
作者:
Shyy-Woei Chang
a
;
Horng-Wen Wu
b
;
z7708033@email.ncku.edu.tw
;
Da-Yu. Guo
b
;
Jun-jie Shi
b
;
Tang-Hong Chen
b
关键词:
Natural convection
;
Heat transfer enhancement
;
Dimpled
fin
array
刊名:International Journal of Heat and Mass Transfer
出版年:2017
2.
Effect of bleed hole on flow and heat transfer performance of U-shaped channel with dimple structure
作者:
Zhongyang Shen
;
Huancheng Qu
;
Di Zhang
;
Yonghui Xie
关键词:
Dimple
;
Bleed hole
;
U-shaped channel
;
Heat transfer
;
Numerical simulation
刊名:International Journal of Heat and Mass Transfer
出版年:2013
3.
Heat transfer and pressure drop in
dimpled
fin
channels
作者:
S.W. Chang
;
K.F. Chiang
;
T.L. Yang
;
C.C. Huang
关键词:
Dimpled
fin
channel
;
Heat transfer augmentation
刊名:Experimental Thermal and Fluid Science
出版年:2008
4.
Influence of SrTiO
3
nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads
作者:
Tama Fouzder
a
;
Ismathullakhan Shafiq
a
;
Y.C. Chan
a
;
eeycchan@cityu.edu.hk
;
A. Sharif
b
;
Winco K.C. Yung
c
关键词:
Nano doping
;
Ball grid
array
solder joints
;
Shearing force
;
Microstructure
刊名:Journal of Alloys and Compounds
出版年:2011
5.
Effect of small Sn–3.5Ag–0.5Cu additions on the structure and properties of Sn–9Zn solder in ball grid
array
packages
作者:
Asit Kumar Gain
;
Y.C. Chan
;
Ahmed Sharif
;
Winco K.C. Yung
关键词:
Microstructure
;
Ball grid
array
solder joints
;
Shearing force
刊名:Microelectronic Engineering
出版年:2009
6.
Effect of nano Al
2
O
3
additions on the microstructure, hardness and shear strength of eutectic Sn–9Zn solder on Au/Ni metallized Cu pads
作者:
Tama Fouzder
;
Asit Kumar Gain
;
Y.C. Chan
;
A. Sharif
;
Winco K.C. Yung
刊名:Microelectronics Reliability
出版年:2010
7.
Interfacial microstructure and shear strength of Ag nano particle doped Sn–9Zn solder in ball grid
array
packages
作者:
Asit Kumar Gain
;
Y.C. Chan
;
Ahmed Sharif
;
N.B. Wong
;
Winco K.C. Yung
刊名:Microelectronics Reliability
出版年:2009
1
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