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Wiley电子期刊(6)	ProQuest学位论文(13)	Elsevier电子期刊(540)
SpringerLink电子期刊(182)	NATURE电子期刊(3)	ACS电子期刊(20)

在“Elsevier电子期刊”中，命中：540条，耗时：0.0220139 秒

在所有数据库中总计命中：764条

1.Heat transfer finite element model of fresh fruit salad insulating packages in non-refrigerated conditions

作者：Chiara Cevoli ; ^{chiara.cevoli3@unibo.it} ; Angelo Fabbri

关键词：Finite element model ; Fruit salad ; Cool chain ; Thermal insulation

刊名：Biosystems Engineering

出版年：2017

2.Using Taguchi method to obtain the optimal design of heat dissipation mechanism for electronic component packaging

作者：De-Shau Huang^a ; Wen-Bin Tu^b ; Xiu-Ming Zhang^b ; Liang-Te Tsai^b ; Ti-Yuan Wu^b ; Ming-Tzer Lin^b ; ^{mingtlin@nchu.edu.tw" class="auth_mail" title="E-mail the corresponding author}

关键词：Electronic component packaging ; Thermal stress ; Finite element method ; Taguchi method

刊名：Microelectronics Reliability

出版年：2016

3.Analytical and finite element modeling of through glass via thermal stress

作者：A. Benali^a ; ^b ; ^{benali.abdellah7@gmail.com" class="auth_mail" title="E-mail the corresponding author} ; M. Faqir^a ; M. Bouya^a ; A. Benabdellah^b ; M. Ghogho^a ; ^c

关键词：Thermal stress ; Through glass via (TGV) ; Finite element analysis (FEA) ; Three dimensional (3D) packaging ; Analytical model

刊名：Microelectronic Engineering

出版年：2016

4.Effect of residual stress on the performance of self-packaging piezoresistive pressure sensor in wireless capsule

作者：Kai Zhao ; ^{zhao_kai@sjtu.edu.cn" class="auth_mail" title="E-mail the corresponding author}Author Vitae ; Guozheng YanAuthor Vitae

关键词：Piezoresistive pressure sensor ; Residual stress ; Self-packaging structure ; Finite element analysis ; Optimal design ; Wireless capsule

刊名：Sensors and Actuators A: Physical

出版年：2016

5.The role of alloying elements on the sintering of Cu

作者：Huali Hao ; Shulong Ye ; Kaiping Yu ; Peng Chen ; Ruinan Gu ; Peng Yu ; ^{yup@sustc.edu.cn" class="auth_mail" title="E-mail the corresponding author} ; ^{yp1975@gmail.com" class="auth_mail" title="E-mail the corresponding author}

关键词：Copper ; Sintering ; Alloying elements

刊名：Journal of Alloys and Compounds

出版年：2016

6.Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling

作者：Yuan-Wei Chang^a ; ^b ; ^{aone.chang@gmail.com" class="auth_mail" title="E-mail the corresponding author} ; Yin Cheng^a ; ^c ; ^{yin.cheng@gmx.com" class="auth_mail" title="E-mail the corresponding author} ; Feng Xu^a ; Lukas Helfen^a ; ^c ; ^d ; ^{lukas.helfen@kit.edu" class="auth_mail" title="E-mail the corresponding author} ; Tian Tian^e ; Marco Di Michiel^d ; Chih Chen^b ; King-Ning Tu^e ; Tilo Baumbach^a ; ^c

关键词：Electromigration ; Flip-chip ; Laminography ; Synchrotron radiation ; Finite-element modeling

刊名：Acta Materialia

出版年：2016

7.Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis

作者：Fa Xing Che ^{chef@ime.a-star.edu.sg" class="auth_mail" title="E-mail the corresponding author} ^{chefaxing@pmail.ntu.edu.sg" class="auth_mail" title="E-mail the corresponding author} ; Xiaowu Zhang ; Jong-Kai Lin

关键词：Through-silicon interposer (TSI) ; Si-less interconnection technology (SLIT) ; Finite element analysis (FEA) ; Solder joint reliability ; Stress analysis

刊名：Microelectronics Reliability

出版年：2016

8.Circular economy: To be or not to be in a closed product loop? A Life Cycle Assessment of aluminium cans with inclusion of alloying elements

作者：Monia Niero ; ^{monni@dtu.dk" class="auth_mail" title="E-mail the corresponding author} ; Stig Irving Olsen

关键词：BAU ; business as usual ; C2C ; Cradle to Cradle® ; design framework ; CR ; collection rate ; EAA ; European Aluminium Association ; EoL ; end-of-life ; FU ; functional unit ; GHG ; greenhouse gases ; LCA ; Life Cycle Assessment ; LCI ; Life Cycle Inventory ; LCIA ; Life Cycle Impact Assessment ; MAP ; mixed aluminium packaging ; PEF ; Product Environmental Footprint ; RC ; recycled content ; RE ; renewable energy ; RR ; recycling rate ; UBC ; used beverage can ; Ypre-proc ; yield during pre-processing ; Yremelt ; yield during

刊名：Resources, Conservation & Recycling

出版年：2016

9.Compression strength of ventilated corrugated paperboard packages: Numerical modelling, experimental validation and effects of vent geometric design

作者：Tobi Fadiji^a ; ^b ; Corne Coetzee^a ; Umezuruike Linus Opara^b ; ^c ; ^{opara@sun.ac.za} ; ^{umunam@yahoo.co.uk}

关键词：Finite element analysis ; Buckling load ; Ventilated packaging ; Relative humidity ; Temperature ; Vent

刊名：Biosystems Engineering

出版年：2016

10.IBDV particles packaged with only segment A dsRNA

作者：Yung-Yi C. Mosley ; Ching Ching Wu ; Tsang Long Lin ; ^{tllin@purdue.edu" class="auth_mail" title="E-mail the corresponding author}

关键词：IBDV ; IBDV-A viral particles ; Segment A ; Cis-acting packaging signals ; Noncoding regions

刊名：Virology

出版年：2016

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