设为首页
收藏本站
网站地图
|
English
|
公务邮箱
About the library
Background
History
Leadership
Organization
Readers' Guide
Opening Hours
Collections
Help Via Email
Publications
Electronic Information Resources
常用资源
电子图书
期刊论文
学位会议
外文资源
特色专题
内部出版物
Wiley电子期刊(2)
ProQuest学位论文(1)
Elsevier电子期刊(155)
SpringerLink电子期刊(13)
NATURE电子期刊(6)
ACS电子期刊(9)
在“
Elsevier电子期刊
”中,
命中:
155
条,耗时:小于0.01 秒
在所有数据库中总计命中:
186
条
1.
Global digital controller for multi-channel micro-stimulator with 5-wire interface featuring on-the-fly power-supply modulation and tissue impedance monitoring
作者:
Paul Jung-Ho Lee
a
;
Man-Kay Law
b
;
mklaw@umac.mo
;
Amine Bermak
a
;
c
关键词:
Multi-channel micro-stimulator
;
Global digital controller
;
Tissue-electrode impedance
;
Power supply modulation
刊名:
Microelectronics
Journal
出版年:2017
2.
Flexible
opto-electronics enabled microfluidics systems with cloud connectivity for point-of-care micronutrient analysis
作者:
Stephen Lee
b
;
1
;
slee@mc10inc.com" class="auth_mail" title="E-mail the corresponding author
;
A.J. Aranyosi
b
;
1
;
Michelle D. Wong
a
;
Ji Hyung Hong
b
;
Jared Lowe
b
;
Carol Chan
a
;
David Garlock
b
;
Scott Shaw
b
;
Patrick D. Beattie
a
;
Zachary Kratochvil
b
;
Nick Kubasti
b
;
Kirsten Seagers
b
;
Roozbeh Ghaffari
b
;
rghaffari@mc10inc.com" class="auth_mail" title="E-mail the corresponding author
;
Christina D. Swanson
a
;
1
;
cswanson@dfa.org" class="auth_mail" title="E-mail the corresponding author
关键词:
Point-of-care
;
Diagnostic
;
Micronutrients
;
Paper microfluidic assay
;
Flexible
microelectronics
;
Near field communication
刊名:Biosensors and Bioelectronics
出版年:2016
3.
Performance analysis of meander-type inductor in silicon and
flexible
technology
作者:
Aleksandar Pajkanovic
;
apaj@uns.ac.rs" class="auth_mail" title="E-mail the corresponding author
;
Goran M. Stojanovic
;
Snezana M. Djuric
关键词:
CMOS technology
;
Flexible
technology
;
Inductor
;
Characterization
刊名:
Microelectronics
Journal
出版年:2016
4.
Electromechanical reliability of a
flexible
metal-grid transparent electrode prepared by electrohydrodynamic (EHD) jet printing
作者:
Sang Min Yang
a
;
Yo Seb Lee
a
;
Yonghee Jang
b
;
Doyoung Byun
b
;
dybyun@skku.edu" class="auth_mail" title="E-mail the corresponding author
;
Sung-Hoon Choa
a
;
shchoa@seoultech.ac.kr" class="auth_mail" title="E-mail the corresponding author
关键词:
Flexible
transparent electrode
;
Metal grid
;
Electrohydrodynamic printing
;
Electromechanical reliability
刊名:
Microelectronics
Reliability
出版年:2016
5.
Wet microelectronic technologies on paper substrate for
flexible
electronic applications
作者:
Mamadou Balde
balde@ies.univ-montp2.fr" class="auth_mail" title="E-mail the corresponding author
Author Vitae
;
Fanny Jacquemoud-Collet
;
Arnaud VenaAuthor Vitae
;
Brice Sorli
;
brice.sorli@um2.fr" class="auth_mail" title="E-mail the corresponding author
;
ma.sal.balde@gmail.com" class="auth_mail" title="E-mail the corresponding author
Author Vitae
关键词:
Flexible
electronic
;
Paper substrate
;
Microelectronic technologies
刊名:Sensors and Actuators A: Physical
出版年:2016
6.
Effect of H/Ar treatment on ZnO:B transparent conducting oxide for
flexible
a-Si:H/μc-Si:H photovoltaic modules under damp heat stress
作者:
Jae-Seong Jeong
a
;
c
;
jjseicp@keti.re.kr" class="auth_mail" title="E-mail the corresponding author
;
jjseicp@naver.com" class="auth_mail" title="E-mail the corresponding author
;
Yong-Huyn Kim
b
;
Chang-Kyun Park
b
;
Heon-Do Kim
b
;
Joongho Choi
c
关键词:
a-Si
;
H/μc-Si
;
H PV
;
ZnO
;
B TCO thin film
;
H/Ar treatment
;
Mechanism
;
Damp heat
刊名:
Microelectronics
Reliability
出版年:2016
7.
The effect of bending loading conditions on the reliability of inkjet printed and evaporated silver metallization on polymer substrates
作者:
O. Glushko
a
;
b
;
M.J. Cordill
a
;
b
;
megan.cordill@oeaw.ac.at" class="auth_mail" title="E-mail the corresponding author
;
A. Klug
c
;
E.J.W. List-Kratochvil
c
;
d
关键词:
Inkjet printed silver
;
Printed electronics
;
Flexible
substrate
;
Bending test
;
Tensile
;
Compressive
;
Crack density
刊名:
Microelectronics
Reliability
出版年:2016
8.
Electrical characteristics of a-IGZO transistors along the in-plane axis during outward bending
作者:
Chang Bum Park
;
bum319@snu.ac.kr" class="auth_mail" title="E-mail the corresponding author
;
HyungIl Na
;
Soon Sung Yoo
;
Kwon-Shik Park
关键词:
a-IGZO transistor
;
Bending stress
;
Flexible
display
;
Mechanical strain
;
Polyimide substrate
刊名:
Microelectronics
Reliability
出版年:2016
9.
Resilient routing implementation in 2D mesh NoC
作者:
Rimpy Bishnoi
a
;
rimpybishnoi@gmail.com" class="auth_mail" title="E-mail the corresponding author
;
Vijay Laxmi
a
;
Manoj Singh Gaur
a
;
vlgaur@gmail.com" class="auth_mail" title="E-mail the corresponding author
;
gaurms@gmail.com" class="auth_mail" title="E-mail the corresponding author
;
Mark Zwolinski
b
;
mz@ecs.soton.ac.uk" class="auth_mail" title="E-mail the corresponding author
关键词:
NoC
;
Routing implementation
;
Fault tolerance
;
Segment routing
刊名:
Microelectronics
Reliability
出版年:2016
10.
A 12 bit 250 MS/s 28 mW +70 dB SFDR non-50% RZ DAC in 0.11 µm CMOS using controllable RZ window for wireless SoC integration
作者:
Seonggeon Kim
a
Author Vitae
;
Jaehyun Kang
b
Author Vitae
;
Minjae Lee
a
;
minjae@gist.ac.kr" class="auth_mail" title="E-mail the corresponding author
Author Vitae
关键词:
Digital-to-analog converter (DAC)
;
Dynamic-element matching (DEM)
;
Return-to-zero (RZ)
;
Spurious-free dynamic range (SFDR)
;
Signal-to-noise ratio (SNR)
;
Noise spectral density (NSD)
刊名:
Microelectronics
Journal
出版年:2016
1
2
3
4
5
6
7
8
9
按检索点细分(155)
题名(2)
关键词(1)
文摘(18)
按出版年细分(155)
2027年及以后(10)
2017年(1)
2016年(11)
2015年(5)
2013年(10)
2012年(14)
2011年(9)
2010年(11)
2009年(7)
2008年(11)
2007年(5)
2006年(8)
2005年(4)
2004年(7)
2003年(3)
2002年(6)
2001年(5)
2000年(4)
2000年及以前(24)
NGLC 2004-2010.National Geological Library of China All Rights Reserved.
Add:29 Xueyuan Rd,Haidian District,Beijing,PRC. Mail Add: 8324 mailbox 100083
For exchange or info please contact us via
email
.