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内部出版物
Wiley电子期刊(1)
SpringerLink电子期刊(6)
ProQuest学位论文(3)
Elsevier电子期刊(19)
在“
Elsevier电子期刊
”中,
命中:
19
条,耗时:0.0250158 秒
在所有数据库中总计命中:
29
条
1.
Area and power savings via asymmetric organizati
on
of buffers in
3D
-NoCs for
heterogeneous
3D-SoCs
作者:
Jan Moritz Joseph
;
a
;
jan.joseph@iovgu.de
;
Author Vitae
;
Christopher Blochwitz
b
;
blochwitz@iti.uni-luebeck.de
;
Author Vitae
;
Alberto Garcí
;
a-Ortiz
c
;
agarcia@item.uni-bremen.de
;
Author Vitae
;
Thilo Pi
on
teck
a
;
thilo.pi
on
teck@ovgu.de
;
Author Vitae
关键词:
Network-
on
-
Chip
;
Heterogeneous
3D
-
System
-
on
-
Chip
;
Asymmetric
3D
-Noc
;
Buffer reorganizati
on
;
Buffer depths
刊名:Microprocessors and Micro
system
s
出版年:2017
2.
3D
Stacked
Chip
s: from Emerging Processes to
Heterogeneous
System
s. Springer (2016), ISBN: 978-3-319-20481-9
作者:
Ch
on
g Le
on
g Gan
a
;
b
;
clgan_pgg@yahoo.com" class="auth_mail" title="E-mail the corresp
on
ding author
;
Uda Hashim
b
刊名:Microelectr
on
ics Reliability
出版年:2016
3.
Efficient routing techniques in
heterogeneous
3D
Networks-
on
-
Chip
作者:
Michael Opoku Agyeman
;
Ali Ahmadinia
;
Alireza Shahrabi
关键词:
Networks-
on
-
Chip
;
3D
integrati
on
;
Performance evaluati
on
刊名:Parallel Computing
出版年:2013
4.
Reducti
on
methods for adapting optical network
on
chip
topologies to
3D
architectures
作者:
Sé
;
bastien Le Beux
a
;
Sebastien.Le-Beux@ec-ly
on
.fr
Author Vitae
;
Ian O&rsquo
;
C
on
nor
a
;
Ian.OC
on
nor@ec-ly
on
.fr
Author Vitae
;
Gabriela Nicolescu
b
;
Gabriela.Nicolescu@polymtl.ca
Author Vitae
;
Guy Bois
b
;
Guy.Bois@polymtl.ca
Author Vitae
;
Pierre Paulin
c
;
Pierre.Paulin@st.com
Author Vitae
关键词:
Optical network
on
chip
;
MPSoC
;
Design methodology
;
3D
architectures
刊名:Microprocessors and Micro
system
s
出版年:2013
5.
3D
thermal-aware floorplanner using a MOEA approximati
on
作者:
David Cuesta
;
Jos¨¦ L. Risco-Martin
;
Jos¨¦ L. Ayala
;
J. Ignacio Hidalgo
关键词:
3D
architecture
;
Thermal-aware floorplan
;
Temperature
;
Reliability
;
Hot spots
;
Evoluti
on
ary algorithm
;
Through silic
on
vias optimizati
on
刊名:Integrati
on
, the VLSI Journal
出版年:2013
6.
A novel 3-D FPGA architecture targeting communicati
on
intensive applicati
on
s
作者:
Harry Sidiropoulos
;
Kostas Siozios
;
Dimitrios Soudris
关键词:
3D
architecture
;
FPGA
;
Heterogeneous
architecture
;
CAD tool
刊名:Journal of
System
s Architecture
出版年:January, 2014
7.
Design space explorati
on
of thermal-aware many-core
system
s
作者:
Kameswar Rao Vaddina
;
Amir-Mohammad Rahmani
;
Mohammad Fattah
;
Pasi Liljeberg
;
Juha Plosila
关键词:
Thermal analysis
;
Thermal modeling
;
3D
Networks-
on
-
Chip
;
Thermal management
;
Thermal placement
刊名:Journal of
System
s Architecture
出版年:November, 2013
8.
Thermal modeling and analysis of advanced
3D
stacked structures
作者:
Kameswar Rao Vaddina
a
;
Amir-Mohammad Rahmani
a
;
Khalid Latif
a
;
Pasi Liljeberg
b
;
vadrao@utu.fi
;
Juha Plosila
b
;
a
关键词:
Thermal analysis
;
thermal modeling
;
3D
networks-
on
-
chip
;
hotspots
;
thermal management
;
stacked IC's
刊名:Procedia Engineering
出版年:2012
9.
FPGA prototyping of emerging manycore architectures for parallel programming research using Formic boards
作者:
Spyros Lyberis
a
;
b
;
spyros.lyberis@gmail.com" class="auth_mail
;
papaef@ics.forth.gr" class="auth_mail
Author Vitae
;
George Kalokerinos
a
Author Vitae
;
Michalis Lygerakis
a
Author Vitae
;
Vassilis Papaefstathiou
a
;
b
Author Vitae
;
Iakovos Mavroidis
a
Author Vitae
;
Manolis Katevenis
a
;
b
Author Vitae
;
Di
on
isios Pnevmatikatos
a
;
c
Author Vitae
;
Dimitrios S. Nikolopoulos
a
;
d
Author Vitae
关键词:
Manycore
;
FPGA
;
Multi-board prototyping
;
N
on
-coherent architecture
;
Formic
刊名:Journal of
System
s Architecture
出版年:June 2014
10.
Adaptive inter-layer message routing in
3D
networks-
on
-
chip
作者:
Claudia
;
Rusu
a
;
;
claudia.rusu@imag.fr
;
Lorena
;
Anghel
a
;
;
lorena.anghel@imag.fr
;
Dimiter
;
Avresky
b
;
;
c
;
;
aut
on
omic@irianc.com
[Author vitae]
关键词:
Fault-tolerance
;
Rec
on
figurati
on
;
Deadlock-free
;
Routing
;
3D
network-
on
-
chip
刊名:Microprocessors and Micro
system
s
出版年:2011
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