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在“
Elsevier电子期刊
”中,
命中:
1,312
条,耗时:0.0659608 秒
在所有数据库中总计命中:
1,956
条
1.
Investigation of soldering process and
interfacial
microstructure
evolution
for the formation of full Cu
3
Sn joints in electronic packaging
作者:
Peng Yao
;
kaka3778@126.com
;
Xiaoyan Li
;
Xiaobo Liang
;
Bo Yu
关键词:
Electronic packaging
;
Full Cu3Sn joints
;
Soldering temperature
;
Soldering pressure
;
Soldering time
;
Interfacial
microstructure
evolution
刊名:Materials Science in Semiconductor Processing
出版年:2017
2.
Interfacial
reaction and microstructural
evolution
of Ag-Cu braze on BaCo
0.7
Fe
0.2
Nb
0.1
O
3-δ
at high temperature in air
作者:
Yuwen Zhang
;
springzyw@shu.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Lili Zhang
;
Wei Guo
;
Ting Liu
;
Chengzhang Wu
;
Weizhong Ding
;
Xionggang Lu
关键词:
Ag-Cu braze
;
Mixed ionic-electronic conducting oxides ceramics
;
Reactive air brazing
;
Wetting
;
Interfacial
reaction
;
Ridge
evolution
刊名:Ceramics International
出版年:2017
3.
Highly efficient photocatalytic H
2
evolution
over MoS
2
/CdS-TiO
2
nanofibers prepared by an electrospinning mediated photodeposition method
作者:
Na Qin
a
;
Jinhua Xiong
a
;
Ruowen Liang
a
;
Yuhao Liu
a
;
Shiying Zhang
b
;
Yanhua Li
b
;
Zhaohui Li
a
;
;
Ling Wu
a
;
wuling@fzu.edu.cn" class="auth_mail" title="E-mail the corresponding author
关键词:
Electrospinning
;
Photodeposition
;
MoS2/CdS-TiO2 nanofibers
;
Interfacial
contact
;
Photocatalytic H2
evolution
刊名:Applied Catalysis B: Environmental
出版年:2017
4.
Microstructural
evolution
mechanisms of Ti600 and Ni-25%Si joint brazed with Ti-Zr-Ni-Cu amorphous filler foil
作者:
Xiaopeng Li
a
;
Houqin Wang
a
;
Ting Wang
b
;
fgwangting@163.com" class="auth_mail" title="E-mail the corresponding author
;
Binggang Zhang
a
;
zhangbg@hit.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Tao Yu
a
;
Ruishan Li
a
关键词:
Ti600 alloy
;
Ni-25at%Si alloy
;
Ti-Zr-Ni-Cu amorphous filler foil
;
Brazing
;
Interfacial
microstructure
;
Evolution
mechanism
刊名:Journal of Materials Processing Technology
出版年:2017
5.
Influence of rapid solidification on Sn-8Zn-3Bi alloy characteristics and microstructural
evolution
of solder/Cu joints during elevated temperature aging
作者:
Guo-ji ZHAO
;
zhaoguoji2006@sina.com
;
Guang-hua WEN
;
Guang-min SHENG
关键词:
rapid solidification
;
Sn&ndash
;
8Zn&ndash
;
3Bi solder
;
melting characteristic
;
aging
;
microstructural
evolution
刊名:Transactions of Nonferrous Metals Society of China
出版年:2017
6.
Microstructure
evolution
in HR3C austenitic steel during long-term creep at 650 °C
作者:
Zhen Zhang
a
;
Zhengfei Hu
a
;
huzhengf@tongji.edu.cn
;
Haoyun Tu
b
;
Siegfried Schmauder
b
;
Gaoxiang Wu
c
关键词:
Austenitic steel
;
Creep strength
;
Microstructure
evolution
;
Precipitation strengthening
;
Intergranular damage
刊名:Materials Science and Engineering: A
出版年:2017
7.
One-dimensional CdS@MoS
2
core-shell nanowires for boosted photocatalytic hydrogen
evolution
under visible light
作者:
Bin Han
a
;
Siqi Liu
a
;
b
;
Nan Zhang
a
;
b
;
Yi-Jun Xu
a
;
b
;
yjxu@fzu.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Zi-Rong Tang
a
;
zrtang@fzu.edu.cn" class="auth_mail" title="E-mail the corresponding author
关键词:
Core-shell
;
Nanowires
;
CdS
;
MoS2
;
Photocatalytic hydrogen
evolution
刊名:Applied Catalysis B: Environmental
出版年:2017
8.
Interfacial
reactions and microstructural
evolution
of periodic Ni nanodot arrays on N
2
+
-implanted amorphous Si substrates
作者:
S.L. Cheng
a
;
b
;
slcheng@ncu.edu.tw
;
R.H. Lai
a
;
Y.D. Huang
a
;
H.C. Lin
a
关键词:
Nanosphere lithography
;
N2+-implantation
;
Amorphous Si
;
Ni silicide
;
Nanoring
刊名:Applied Surface Science
出版年:2017
9.
Stress
evolution
mechanism of NiCr thin films on titanium alloy
作者:
Vijay Petley
a
;
K.H. Thulasi Raman
b
;
Sathish Kumar
b
;
Rajeev Jain
a
;
G. Mohan Rao
b
;
gmrao@isu.iisc.ernet.in
关键词:
Ni-Cr alloy thin films
;
Shear lag model
;
Inter crack spacing
;
Interfacial
shear stress
刊名:Journal of Alloys and Compounds
出版年:2017
10.
A variational treatment of material configurations with application to interface motion and microstructural
evolution
作者:
Gregory H. Teichert
a
;
Shiva Rudraraju
a
;
Krishna Garikipati
b
;
krishna@umich.edu
关键词:
Free energy
;
Thermodynamic driving force
;
Gradient regularization
;
Configurational stress
;
Spline basis functions
刊名:Journal of the Mechanics and Physics of Solids
出版年:2017
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