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SpringerLink电子期刊(20)
Elsevier电子期刊(37)
ACS电子期刊(1)
在“
Elsevier电子期刊
”中,
命中:
37
条,耗时:0.0839605 秒
在所有数据库中总计命中:
58
条
1.
Employment of roll-offset printing for fabrication of
solder
bump arrays: Harnessing the rheological properties of
lead
-
free
solder
paste
s using particle size distribution
作者:
Min-Jung Son
a
;
c
;
Inyoung Kim
a
;
d
;
ikim@kimm.re.kr" class="auth_mail" title="E-mail the corresponding author
;
Sangsun Yang
b
;
Taik-Min Lee
a
;
d
;
Hoo-Jeong Lee
c
;
hlee@skku.edu" class="auth_mail" title="E-mail the corresponding author
关键词:
Particle size distribution
;
Rheology
;
Lead
-
free
solder
paste
;
Aggregation effect
;
Roll-offset printing
刊名:Microelectronic Engineering
出版年:2016
2.
Flux effect on void quantity and size in
solder
ed joints
作者:
D. Bu&scaron
;
ek
a
;
K. Du&scaron
;
ek
a
;
karel.dusek@fel.cvut.cz" class="auth_mail" title="E-mail the corresponding author
;
D. Růžička
a
;
M. Plaček
a
;
P. Mach
a
;
J. Urbá
;
nek
a
;
J. Starý
;
b
关键词:
Assembly manufacturing
;
Reliability
;
Solder
ing
;
Voids
;
Flux
刊名:Microelectronics Reliability
出版年:2016
3.
Transient liquid phase Ag-based
solder
technology for high-temperature packaging applications
作者:
Ahmed Sharif
;
Chee Lip Gan
;
Zhong Chen
关键词:
Harsh environment
;
Microelectronics packaging
;
Transient-liquid-phase
;
High-temperature reliability
;
Intermetallic compounds
刊名:Journal of Alloys and Compounds
出版年:25 February, 2014
4.
Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn-3.8Ag-0.7Cu
lead
-
free
solder
and copper substrate
作者:
S.L. Tay
a
;
A.S.M.A. Haseeb
a
;
haseeb@um.edu.my
;
Mohd Rafie Johan
a
;
P.R. Munroe
b
;
M.Z. Quadir
b
关键词:
A. Composites
;
A. Intermetallics
;
B. Diffusion
;
D. Phase interfaces
;
F. Electron microscopy
;
transmission
刊名:Intermetallics
出版年:2013
5.
The effect of wall-slip formation on the rheological behaviour of
lead
-
free
solder
paste
s
作者:
R. Durairaj
;
Lam Wai Man
;
N.N. Ekere
;
S. Mallik
关键词:
Lead
-
free
;
Solder
paste
;
Rheology
;
Viscosity
;
Wall-slip
;
Stencil printing process
刊名:Materials and Design
出版年:2010
6.
Optimal combination of
solder
ing conditions of BGA for halogen-
free
and
lead
-
free
SMT-green processes
作者:
Ming-Hung Shu
;
Bi-Min Hsu
;
Min-Chuan Hu
刊名:Microelectronics Reliability
出版年:2012
7.
Intermetallic compound growth suppression at high temperature in SAC
solder
s with Zn addition on Cu and Ni¨CP substrates
作者:
H.R.
;
Kotadia
a
;
;
hiren.kotadia@kcl.ac.uk
;
O.
;
Mokhtari
a
;
M.P.
;
Clode
b
;
M.A.
;
Green
a
;
S.H.
;
Mannan
a
关键词:
Solder
ing
;
Lead
-
free
solder
;
Intermetallic compounds
;
Sn&ndash
;
Ag&ndash
;
Cu alloys
刊名:Journal of Alloys and Compounds
出版年:2012
8.
Recombination and Microstructural Properties of
Solder
ing Pads and their Impact on Solar Cell Performance
作者:
Karin Krau?
;
Fabian Fertig
;
Stefan Rein
关键词:
Solar cells
;
Met allization
;
Recombination
;
Loss analysis
刊名:Energy Procedia
出版年:2013
9.
Characterization of a laser-
solder
ed avionic component using
lead
-
free
paste
作者:
M.S.F. Lima
;
R. Riva
;
M.G. Destro
;
A.M.E. Santo
;
R.A. Silva Jr.
;
S.M. Guimaraes
关键词:
Lead
-
free
solder
ing
;
Laser
solder
ing
;
Electrical contacts
刊名:Optics and Laser Technology
出版年:2009
10.
Evaluation of rheological properties of
lead
-
free
solder
paste
s and their relationship with transfer efficiency during stencil printing process
作者:
E.H. Amalu
;
a
;
E.H.Amalu@greenwich.ac.uk
;
N.N. Ekere
a
;
S. Mallik
a
关键词:
D. Adhesives
;
F. Elastic and plastic behaviour
;
G. Non-destructive testing (NDT)
刊名:Materials and Design
出版年:2011
1
2
3
4
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