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内部出版物
SpringerLink电子期刊(3)
在“
SpringerLink电子期刊
”中,
命中:
3
条,耗时:0.0159924 秒
在所有数据库中总计命中:
3
条
1.
Aluminum-Scandium: A Material for Semiconductor Packaging
作者:
Ute Geissler
;
Sven Thomas
;
Martin
Schneider
-
Ramelow
…
关键词:
Wire bonding
;
bond
;
pad chip metallization
;
bonding wires
;
Cu bonding
;
Al bonding
;
precipitation hardening
;
ultrasonic softening
;
aluminum
;
scandium
;
Al
;
Sc
刊名:Journal of Electronic Materials
出版年:2016
2.
Development and Status of Cu Ball/Wedge Bonding in 2012
作者:
Martin
Schneider
-
Ramelow
(1)
Ute Gei?ler (2)
Stefan Schmitz (1)
Wolfgang Grübl (3)
Bernhard Schuch (3)
关键词:
Wire bonding
;
Cu bonding
;
ball/wedge bonding
;
quality
;
reliability
刊名:Journal of Electronic Materials
出版年:2013
3.
Development and Status of Cu Ball/Wedge Bonding in 2012
作者:
Martin
Schneider
-
Ramelow
(1)
Ute Gei脽ler (2)
Stefan Schmitz (1)
Wolfgang Gr眉bl (3)
Bernhard Schuch (3)
关键词:
Wire bonding
;
Cu bonding
;
ball/wedge bonding
;
quality
;
reliability
刊名:Journal of Electronic Materials
出版年:2013
1
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按出版年细分(3)
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