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SpringerLink电子期刊(7)
NATURE电子期刊(1)
Elsevier电子期刊(8)
ACS电子期刊(1)
在“
Elsevier电子期刊
”中,
命中:
8
条,耗时:0.015999 秒
在所有数据库中总计命中:
17
条
1.
Employment of
roll
-
offset
printing
for fabrication of solder bump arrays: Harnessing the rheological properties of lead-free solder pastes using particle size distribution
作者:
Min-Jung Son
a
;
c
;
Inyoung Kim
a
;
d
;
ikim@kimm.re.kr" class="auth_mail" title="E-mail the corresponding author
;
Sangsun Yang
b
;
Taik-Min Lee
a
;
d
;
Hoo-Jeong Lee
c
;
hlee@skku.edu" class="auth_mail" title="E-mail the corresponding author
关键词:
Particle size distribution
;
Rheology
;
Lead-free solder paste
;
Aggregation effect
;
Roll
-
offset
printing
刊名:Microelectronic Engineering
出版年:2016
2.
Roll
offset
printing
process based on interface separation for fine and smooth patterning
作者:
Taik-Min Lee
;
Hyun-Suk Han
;
Bongmin Kim
;
Sun-Woo Kwak
;
Jae-Ho Noh
;
Inyoung Kim
关键词:
Printing
;
Offset
printing
;
Interface separation
;
Roll
printing
;
Printed electronics
刊名:Thin Solid Films
出版年:2 December, 2013
3.
A modified
offset
roll
printing
for thin film transistor applications
作者:
Nackbong Choi
a
;
nbc308@lehigh.edu
;
Hwabok Wee
b
;
Seunghee Nam
c
;
Jean Lavelle
d
;
Miltiadis Hatalis
a
关键词:
Printing
plate (cliché
) ;
Surface energy
;
Offset
roll
printing
;
TFT
刊名:Microelectronic Engineering
出版年:2012
4.
Development of a gravure
offset
printing
system for the
printing
electrodes of flat panel display
作者:
Taik-Min Lee
;
Jae-Ho Noh
;
Chung Hwan Kim
;
Jeongdai Jo
;
Dong-Soo Kim
关键词:
Gravure
offset
;
Printing
;
Printed electronics
;
Roll
to
roll
;
Printing
reliability
刊名:Thin Solid Films
出版年:2010
5.
Hygro-viscoelastic stress analysis in paper web
offset
printing
作者:
J.O. Lif
关键词:
Creep
;
Hygroexpansion
;
Mechanical properties
;
Moisture
;
Offset
printing
;
Relaxation
刊名:Finite Elements in Analysis and Design
出版年:2006
6.
Gravure
offset
printing
of polymer inks for conductors
作者:
Pudas
;
Marko
;
Hagberg
;
Juha
;
Leppä
;
vuori
;
Seppo
关键词:
Gravure
offset
printing
;
Intaglio
printing
;
Conductive ink
;
Square resistance
;
Isotropically conductive adhesive
刊名:Progress in Organic Coatings
出版年:2004
7.
Printing
parameters and ink components affecting ultra-fine-line gravure-
offset
printing
for electronics applications
作者:
Pudas
;
Marko
;
Hagberg
;
Juha
;
Leppä
;
vuori
;
Seppo
关键词:
Ag
;
Conductor inks
;
Gravure
offset
;
Inks
;
Intaglio
;
Thick-films
刊名:Journal of the European Ceramic Society
出版年:2004
8.
Laser soldering of flip-chips
作者:
K. Kordá
s ;
A.E. Pap
;
G. Tó
;
th
;
M. Pudas
;
J. Jä
;
ä
;
skelä
;
inen
;
A. Uusimä
;
ki and J. Vä
;
hä
;
kangas
关键词:
Laser
;
Flip-chip
;
Soldering
;
Finite element modeling
;
Gravure
offset
printing
刊名:Optics and Lasers in Engineering
出版年:2006
1
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