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Elsevier电子期刊(9)
在“
Elsevier电子期刊
”中,
命中:
9
条,耗时:小于0.01 秒
在所有数据库中总计命中:
9
条
1.
Additive Manufacturing of
Sn63Pb37
Component by Micro-coating
作者:
Guangxi Zhao
;
zgx6464946@gmail.com" class="auth_mail" title="E-mail the corresponding author
;
Zhengying Wei
;
Jun Du
;
Wei Liu
;
Xin Wang
;
Yunfei Yao
关键词:
micro-coating
;
shaped metal deposition
;
mechanical properties
;
near-net forming
;
3D printing
;
Sn63Pb37
刊名:Procedia Engineering
出版年:2016
2.
Study on Metal Deposit in the Fused-coating Based Additive Manufacturing
作者:
Xuewei Fang
a
;
Jun Du
b
;
Zhengying Wei
a
;
b
;
fangxuewei0920@gmail.com" class="auth_mail" title="E-mail the corresponding author
;
Xin Wang
a
;
Pengfei He
a
;
Hao Bai
a
;
Bowen Wang
a
;
Jian Chen
a
;
Ruwei Geng
a
;
Bingheng Lu
a
;
b
关键词:
Additive manufacturing
;
Fused-coating
;
Sn63Pb37
;
Heat transfer
;
Process parameters
刊名:Procedia CIRP
出版年:2016
3.
Synthesis creep behavior of
Sn63Pb37
under the applied stress and electric current
作者:
Fu-Zhen
;
Xuan
;
;
;
fzxuan@ecust.edu.cn
;
Shan-Shan
;
Shao
;
Qing-Qi
;
Chen
刊名:Microelectronics Reliability
出版年:2011
4.
The constitutive response of three solder materials
作者:
Alejandro G. Perez-Bergquist
a
;
alexpb@lanl.gov
;
Fang Cao
b
;
Sara J. Perez-Bergquist
a
;
Mike F. Lopez
a
;
Carl P. Trujillo
a
;
Ellen K. Cerreta
a
;
George T. Gray III
a
关键词:
Solder
;
Mechanical properties
;
Microstructure
;
Temperature dependence
;
Strain rate sensitivity
刊名:Journal of Alloys and Compounds
出版年:2012
5.
Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern
作者:
Wei
;
Liu
a
;
Lei
;
Zhang
a
;
K.J.
;
Hsia
b
;
J.K.
;
Shang
a
;
;
c
;
;
jkshang@illinois.edu
关键词:
Wetting
;
Reactive wetting
;
Spreading
;
Solder
;
Thin film pattern
;
Liquid film
刊名:Journal of Materials Science & Technology
出版年:2010
6.
Effects of temperature and strain rate on mechanical property of Sn96.5Ag3Cu0.5
作者:
Fulong Zhu
;
Honghai Zhang
;
Rongfeng Guan
;
Sheng Liu
关键词:
Sn–
;
Ag–
;
Cu
;
Lead-free
;
Work hardening
;
Dynamic recovery
;
Creep resistance
;
Temperature dependence
;
Strain rate sensitivity
刊名:Journal of Alloys and Compounds
出版年:2007
7.
Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping
作者:
Manessis
;
Dionysios
;
Patzelt
;
Rainer
;
Ostmann
;
Andreas
;
Aschenbrenner
;
Rolf
;
Reichl
;
Herbert
刊名:Microelectronics Reliability
出版年:2004
8.
Generalized fracture mechanical integral concept
J
G
and its application in microelectronic packaging technology
作者:
Ghavifekr
;
H.B.
;
Michel
;
B.
关键词:
Fracture mechanics
;
Ball grid array
;
Thermal cycling
刊名:Sensors and Actuators A: Physical
出版年:2002
9.
Characterisation of constitutive behaviour of SnAg, SnAgCu and SnPb solder in flip chip joints
作者:
Wiese
;
S.
;
Feustel
;
F.
;
Meusel
;
E.
关键词:
SnAg
;
SnAgCu
;
SnPb
;
Constitutive behaviour
;
Lead-free solder
;
Flip chip
刊名:Sensors and Actuators A: Physical
出版年:2002
1
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2016年(2)
2012年(1)
2011年(1)
2010年(1)
2007年(1)
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