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内部出版物
Wiley电子期刊(1)
NATURE电子期刊(3)
ACS电子期刊(3)
SpringerLink电子期刊(51)
Elsevier电子期刊(116)
在“
Elsevier电子期刊
”中,
命中:
116
条,耗时:0.0159944 秒
在所有数据库中总计命中:
174
条
1.
Drop-on-demand electromagnetic printing of metallic droplets
作者:
Zhiwei Luo
a
;
b
;
zwluo@xmut.edu.cn
;
Xiang Wang
a
;
wx@xmut.edu.cn
;
Lingyun Wang
b
;
Daoheng Sun
b
;
Zhihong Li
a
关键词:
Deposit
ion
;
Metals and alloys
;
Droplet
;
Electromagnetic printing
;
Solder
printing
刊名:Materials Letters
出版年:2017
2.
Solder
ing aluminium to copper with the use of interlayers
deposit
ed by cold spraying
作者:
Tomasz Wojdat
;
Marcin Winnicki
;
marcin.winnicki@pwr.edu.pl" class="auth_mail" title="E-mail the corresponding author
;
Małgorzata Rutkowska-Gorczyca
;
Szymon Krupiński
;
Krzysztof Kubica
关键词:
Cold spray
;
Solder
ing
;
Interlayers
;
Aluminium coatings
;
Copper coatings
刊名:Archives of Civil and Mechanical Engineering
出版年:2016
3.
Solid-state interfacial reactions of Sn and Sn-Ag-Cu
solder
s with an electroless Co(P) layer
deposit
ed on a Cu substrate
作者:
Chao-hong Wang
;
chmchw@ccu.edu.tw" class="auth_mail" title="E-mail the corresponding author
;
Chun-chieh Wen
;
Che-yang Lin
关键词:
Lead-free
solder
s
;
Electroless
deposit
ion
;
Interfacial reactions
;
Diffusion barrier
刊名:Journal of Alloys and Compounds
出版年:2016
4.
Isothermal Aging of Low-Ag SAC with Al Addition
作者:
M.K. Nur Nadhirah
;
K. Maslinda
;
M.S. Nurulakmal
;
srnurul@usm.my" class="auth_mail" title="E-mail the corresponding author
;
A.S. Anasyida
关键词:
Isothermal aging
;
low-Ag SAC
;
intermetallic compound
刊名:Procedia Chemistry
出版年:2016
5.
Transition to 4 and 5 BB Designs for Ni/Cu/Ag Plated Cells
作者:
J. Burschik
a
;
john.burschik@rena.com
;
Y. Shengzhao
b
;
N. Bay
a
;
K. Crouse
c
;
A. De Rose
a
;
A. Hoffmann
a
;
H. Kü
;
hnlein
a
;
B. Lee
c
;
A. Letize
c
;
M. Passig
a
;
D. Pysch
a
;
M. Sieber
a
;
P. Verlinden
b
;
K. Vosteen
a
关键词:
solar cells
;
plating
;
busbars
;
adhesion
;
Ni/Cu/Ag
刊名:Energy Procedia
出版年:2016
6.
The Solution of a Two-dimensional Inverse Heat Transfer Problem Using the Trefftz Method
作者:
B. Maciejewska
a
;
beatam@tu.kielce.pl" class="auth_mail" title="E-mail the corresponding author
;
K. Strąk
b
;
M. Piasecka
b
关键词:
inverse heat transfer
;
Trefftz method
;
flow boiling
;
minichannel
;
infrared thermography
刊名:Procedia Engineering
出版年:2016
7.
Surface Acoustic Wave Sensors for PM2.5 and PM10 Concentration
作者:
Lyes Djoumi
a
;
b
;
lyes.djoumi@femto-st.fr
;
Virginie Blondeau-Patissier
a
;
Meddy Vanotti
a
;
Jean-Christophe Appert-Collin
c
;
Dominique Thomas
c
;
Laurent Fertier
b
关键词:
PM2.5
;
PM10
;
fine particles
;
SAW sensors
;
air quality
;
cascade impactor
;
aerosol
刊名:Procedia Engineering
出版年:2016
8.
Effect of TiO
2
nanoparticle addition on electroless Ni-P under bump metallization for lead-free
solder
interconnection
作者:
Xiao Hu
a
;
Sha Xu
a
;
Ying Yang
b
;
Zhong Chen
b
;
Y.C. Chan
a
;
eeycchan@cityu.edu.hk" class="auth_mail
关键词:
Lead-free
solder
;
Under bump metallization
;
Electroless
deposit
ion
;
Ni&ndash
;
P&ndash
;
TiO2
;
Interfacial reaction
;
Shear strength
刊名:Materials Science and Engineering: A
出版年:10 April, 2014
9.
Effect of
deposit
thickness during electroplating on Kirkendall voiding at Sn/Cu joints
作者:
Chun Yu
a
;
b
;
Yang Yang
c
;
Jieshi Chen
a
;
Jijin Xu
a
;
Junmei Chen
a
;
Hao Lu
a
;
b
;
shweld@sjtu.edu.cn" class="auth_mail
关键词:
Kirkendall void
;
Deposit
thickness
;
Electronic materials
;
Interfaces
刊名:Materials Letters
出版年:1 August 2014
10.
A study of SnAgCu
solder
paste transfer efficiency and effects of optimal reflow profile on
solder
deposit
s
作者:
E.H. Amalu
a
;
E.H.Amalu@greenwich.ac.uk"" rel=""nofollow
;
W.K. Lau
b
;
N.N. Ekere
a
;
R.S. Bhatti
a
;
S. Mallik
a
;
K.C. Otiaba
a
;
G. Takyi
c
关键词:
Stencil printing
;
Pb-free
solder
;
Reflow profile
;
Solder
deposit
;
Transfer efficiency
;
Surface mount packages
刊名:Microelectronic Engineering
出版年:2011
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