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SpringerLink电子期刊(22)
ProQuest学位论文(1)
Elsevier电子期刊(52)
在“
Elsevier电子期刊
”中,
命中:
52
条,耗时:小于0.01 秒
在所有数据库中总计命中:
75
条
1.
Drop-on-demand electromagnetic
printing
of metallic droplets
作者:
Zhiwei Luo
a
;
b
;
zwluo@xmut.edu.cn
;
Xiang Wang
a
;
wx@xmut.edu.cn
;
Lingyun Wang
b
;
Daoheng Sun
b
;
Zhihong Li
a
关键词:
Deposition
;
Metals and alloys
;
Droplet
;
Electromagnetic
printing
;
Solder
printing
刊名:Materials Letters
出版年:2017
2.
Employment of roll-offset
printing
for fabrication of
solder
bump arrays: Harnessing the rheological properties of lead-free
solder
pastes using particle size distribution
作者:
Min-Jung Son
a
;
c
;
Inyoung Kim
a
;
d
;
ikim@kimm.re.kr" class="auth_mail" title="E-mail the corresponding author
;
Sangsun Yang
b
;
Taik-Min Lee
a
;
d
;
Hoo-Jeong Lee
c
;
hlee@skku.edu" class="auth_mail" title="E-mail the corresponding author
关键词:
Particle size distribution
;
Rheology
;
Lead-free
solder
paste
;
Aggregation effect
;
Roll-offset
printing
刊名:Microelectronic Engineering
出版年:2016
3.
Mechanical and Electrical Contacting of Electronic Components on Textiles by 3D
Printing
作者:
Nils Grimmelsmann
;
Yasmin Martens
;
Patricia Schä
l ;
Hubert Meissner
;
Andrea Ehrmann
;
andrea.ehrmann@fh-bielefeld.de" class="auth_mail" title="E-mail the corresponding author
关键词:
3D
printing
;
textile fabrics
;
conductive yarn
;
electric connection
;
textile electric circuits
刊名:Procedia Technology
出版年:2016
4.
Hardness profiles of Sn-3.0Ag-0.5Cu-TiO
2
composite
solder
by nanoindentation
作者:
Muhamad Zamri Yahaya
a
;
Fakhrozi Che Ani
b
;
Zambri Samsudin
b
;
Salim Sahin
c
;
Mohd Zulkifly Abdullah
d
;
Ahmad Azmin Mohamad
a
;
aam@usm.my" class="auth_mail" title="E-mail the corresponding author
关键词:
Titanium dioxide
;
SAC305
;
Composite
solder
;
Hardness
;
Nanoindentation
刊名:Materials Science & Engineering A
出版年:2016
5.
Drop failure modes of Sn-3.0Ag-0.5Cu
solder
joints in wafer level chip scale package
作者:
Ming-liang HUANG
a
;
huang@dlut.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Ning ZHAO
a
;
Shuang LIU
a
;
Yi-qian HE
b
关键词:
Sn&ndash
;
3.0Ag&ndash
;
0.5Cu
;
wafer level chip scale package
;
solder
joint
;
drop failure mode
刊名:Transactions of Nonferrous Metals Society of China
出版年:2016
6.
A Multi-agent Based Construction of the Digital Eco-factory for a Printed-circuit Assembly Line
作者:
Michiko Matsuda
a
;
matsuda@ic.kanagawa-it.ac.jp" class="auth_mail" title="E-mail the corresponding author
;
Yasuhiro Sudo
a
;
Fumihiko Kimura
b
关键词:
Digital factory
;
Computer aided planning (CAP)
;
Energy efficiency
刊名:Procedia CIRP
出版年:2016
7.
Screen
printing
of
solder
resist as master substrates for fabrication of multi-level microfluidic channels and flask-shaped microstructures for cell-based applications
作者:
Wanqing Yue
a
;
1
;
Cheuk-Wing Li
a
;
1
;
2
;
Tao Xu
a
;
b
;
Mengsu Yang
a
;
b
;
bhmyang@cityu.edu.hk
关键词:
Microfluidic
;
Microfabrication
;
Solder
resist
;
Screen
printing
;
Cell-based assay
刊名:Biosensors and Bioelectronics
出版年:2013
8.
Searching for optimal setting conditions in technological processes using parametric estimation models and neural network mapping approach: A tutorial
作者:
Natalja Fjodorova
;
natalja.fjodorova@ki.si" class="auth_mail" title="E-mail the corresponding author
Author Vitae
;
Marjana Novi膷
关键词:
Design of experiment
;
Optimization methods
;
Feed-forward bottleneck neural network
;
Factorial design
;
Response surface design
刊名:Analytica Chimica Acta
出版年:2015
9.
The simulation of micro droplet behavior of molten lead-free
solder
in inkjet
printing
process and its experimental validation
作者:
Hung-Ju Chang
;
Ming Hsiu Tsai
;
Weng-Sing Hwang
;
wshwang@mail.ncku.edu.tw
关键词:
Mathematical modeling
;
Inkjet
printing
;
Micro droplet
;
VOF
刊名:Applied Mathematical Modelling
出版年:2012
10.
A study of SnAgCu
solder
paste transfer efficiency and effects of optimal reflow profile on
solder
deposits
作者:
E.H. Amalu
a
;
E.H.Amalu@greenwich.ac.uk"" rel=""nofollow
;
W.K. Lau
b
;
N.N. Ekere
a
;
R.S. Bhatti
a
;
S. Mallik
a
;
K.C. Otiaba
a
;
G. Takyi
c
关键词:
Stencil
printing
;
Pb-free
solder
;
Reflow profile
;
Solder
deposit
;
Transfer efficiency
;
Surface mount packages
刊名:Microelectronic Engineering
出版年:2011
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