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内部出版物
SpringerLink电子期刊(8)
GSW全文库(5)
Elsevier电子期刊(46)
在“
Elsevier电子期刊
”中,
命中:
46
条,耗时:0.073959 秒
在所有数据库中总计命中:
59
条
1.
Investigation on thermal characterization of low power SMD LED
mount
ed on different substrate
packages
作者:
Muna E. Raypah
;
muna.ezzi@gmail.com" class="auth_mail" title="E-mail the corresponding author
;
moni.ezzi@yahoo.com" class="auth_mail" title="E-mail the corresponding author
;
Dheepan M.K.
;
Mutharasu Devarajan
;
Fauziah Sulaiman
关键词:
Light-emitting diode
;
Surface
-
Mount
ed Device (SMD)
;
Thermal resistance
;
Junction temperature
;
Thermal transient measurement
;
Simulation
刊名:Applied Thermal Engineering
出版年:2016
2.
Fatigue of Solder Interconnects in Microelectronic Assemblies under Random Vibration
作者:
Cholmin Choi
;
Abhijit Dasgupta
;
dasgupta@umd.edu" class="auth_mail
关键词:
harmonic vibration
;
random vibration
;
vibration durability
;
high cycle fatigue
;
SAC305 solder
;
surface
mount
assembly
;
Heat-sink Very-thin Quad Flat-pack No-leads (HVQFN) component
;
printed wiring assembly
;
time-domain analysis
;
frequency-domain analysis
;
multiscale FEA
;
Coffin-Manson fatigue model
刊名:Procedia Engineering
出版年:2014
3.
A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits
作者:
E.H. Amalu
a
;
E.H.Amalu@greenwich.ac.uk"" rel=""nofollow
;
W.K. Lau
b
;
N.N. Ekere
a
;
R.S. Bhatti
a
;
S. Mallik
a
;
K.C. Otiaba
a
;
G. Takyi
c
关键词:
Stencil printing
;
Pb-free solder
;
Reflow profile
;
Solder deposit
;
Transfer efficiency
;
Surface
mount
packages
刊名:Microelectronic Engineering
出版年:2011
4.
Stratigraphic evidence for the Hirnantian (latest Ordovician) glaciation in the Zagros
Mount
ains, Iran
作者:
Mohammad Ghavidel-syooki
a
;
m_ghavidelsyooki@yahoo.com"" rel=""nofollow
;
J. Javier Á
;
lvaro
b
;
jjalvaro@unizar.es"" rel=""nofollow
;
Leonid Popov
c
;
Leonid.Popov@museumwales.ac.uk"" rel=""nofollow
;
Mansoureh Ghobadi Pour
d
;
m.ghobadipour@gu.ac.ir"" rel=""nofollow
;
Mohammad H. Ehsani
a
;
mh_ehsani@hotmail.com"" rel=""nofollow
;
Anna Suyarkova
e
;
Anna_Suyarkova@vsegei.ru"" rel=""nofollow
关键词:
Diamictite
;
Black shale
;
Unconformity
;
Arabian Plate
;
Gondwana
刊名:Palaeogeography, Palaeoclimatology, Palaeoecology
出版年:2011
5.
Electro- and thermo-migration induced failure mechanisms in Package on Package
作者:
L. Meinshausen
a
;
b
;
lutz.meinshausen@ims-bordeaux.fr
;
K. Weide-Zaage
a
;
H. Fré
;
mont
b
刊名:Microelectronics Reliability
出版年:2012
6.
Magma flow and interaction with waste
packages
in a geologic repository at Yucca
Mount
ain, Nevada
作者:
Bruce D. Marsh
;
Neil M. Coleman
关键词:
magma
;
Yucca
Mount
ain
;
nuclear repository
刊名:Journal of Volcanology and Geothermal Research
出版年:2009
7.
3-D conjugate heat transfer analysis of PLCC
packages
mount
ed in-line on a Printed Circuit Board
作者:
S. Yusoff
;
M. Mohamed
;
K.A. Ahmad
;
M.Z. Abdullah
;
M.A. Mujeebu
;
Z. Mohd Ali
;
F. Idrus
;
Y. Yaakob
关键词:
PLCC package
;
Junction temperature
;
Thermal resistance
;
Nusselt number
刊名:International Communications in Heat and Mass Transfer
出版年:2009
8.
An integrated scheduling problem of PCB components on sequential pick-and-place machines: Mathematical models and heuristic solutions
作者:
William Ho
;
Ping Ji
关键词:
Printed circuit board manufacturing
;
Surface
mount
technology
;
Component sequencing
;
Feeder arrangement
;
Mathematical modeling
;
Genetic algorithm
刊名:Expert Systems with Applications
出版年:2009
9.
Investigation on
packages
of fiber Bragg grating for use as embeddable strain sensor in concrete structure
作者:
P. Biswas
;
S. B
;
yopadhyay
;
K. Kesavan
;
S. Parivallal
;
B. Arun Sundaram
;
K. Ravisankar
;
K. Dasgupta
关键词:
Fiber Bragg grating (FBG)
;
Sensor packaging
;
Embeddable sensor
;
Extrinsic Fabry-Perot interferometer (EFPI)
;
Health monitoring
刊名:Sensors and Actuators A: Physical
出版年:2010
10.
Fracture load prediction of lead-free solder joints
作者:
Siva P.V. Nadimpalli
;
Jan K. Spelt
关键词:
Lead-free solder
;
Strength prediction
;
Critical energy release rate
;
Cohesive zone model
;
Finite element analysis
刊名:Engineering Fracture Mechanics
出版年:2010
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