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Springer电子图书(2)	ProQuest学位论文(3)	ACS电子期刊(2)
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在“Elsevier电子期刊”中，命中：123条，耗时：0.0749299 秒

在所有数据库中总计命中：168条

1.In-situ X-ray μLaue diffraction study of copper through-silicon vias

作者：Dario Ferreira Sanchez^a ; ^b ; ^{Dario.Ferreira@psi.ch" class="auth_mail" title="E-mail the corresponding author} ; ^{dario.f.sanchez@gmail.com" class="auth_mail" title="E-mail the corresponding author} ; Shay Reboh^a ; ^b ; Monica Larissa Djomeni Weleguela^a ; ^b ; Jean-Sé ; bastien Micha^b ; ^c ; ^d ; Odile Robach^b ; ^c ; ^d ; Thierry Mourier^a ; ^b ; ^{thierry.mourier@cea.fr" class="auth_mail" title="E-mail the corresponding author} ; Patrice Gergaud^a ; ^b ; Pierre Bleuet^a ; ^b

关键词：Through silicon vias (TSVs) ; Microelectronics reliability ; Copper extrusion ; Laue micro-diffraction

刊名：Microelectronics Reliability

出版年：2016

2.A design methodology and various performance and fabrication metrics evaluation of 3D Network-on-Chip with multiplexed Through-Silicon Vias

作者：Mostafa Said ; ^a ; ^{mossaied2@gmail.com" class="auth_mail" title="E-mail the corresponding author} ; ^{mostafa.saied@ejust.edu.eg" class="auth_mail" title="E-mail the corresponding author}Author Vitae ; Ahmed Shalaby^b ; ^{ahmed.shalaby@ejust.edu.eg" class="auth_mail" title="E-mail the corresponding author}Author Vitae ; Farhad Mehdipour^c ; ^{farhad@ejust.kyushu-u.ac.jp" class="auth_mail" title="E-mail the corresponding author}Author Vitae ; Morteza Biglari-Abhari^d ; ^{m.abhari@auckland.ac.nz" class="auth_mail" title="E-mail the corresponding author}Author Vitae ; Mohamed El-Sayed^b ; ^{m.ragab@ejust.edu.eg" class="auth_mail" title="E-mail the corresponding author}Author Vitae

关键词：3D Network-on-Chip ; Traffic patterns ; Through-Silicon Vias (TSVs) ; Fabrication yield and cost

刊名：Microprocessors and Microsystems

出版年：2016

3.Low-loss shielded through-silicon vias filled with multi-walled carbon nanotube bundle

作者：Jinrong Su ; Runbo Ma ; Xinwei Chen ; Liping Han ; Rongcao Yang ; Wenmei Zhang ; ^{zhangwm@sxu.edu.cn}

关键词：Forward transmission coefficient ; Multi-walled carbon nanotube (MWCNT) ; Propagation constant ; Through-silicon via (TSV) ; Time delay

刊名：Microelectronics Journal

出版年：2016

4.Copper Through Silicon Vias Studied by Photo-elastic Scanning Infrared Microscopy

作者：M. Herms^a ; ^{martin.herms@pvatepla.com" class="auth_mail" title="E-mail the corresponding author} ; M. Wagner^a ; I. De Wolf^b ; ^c

关键词：copper through silicon vias ; scanning infrared stress explorer ; SIREX ; stress-induced birefringence

刊名：Microelectronics Reliability

出版年：2016

5.The growth of carbon nanotubes on electrically conductive ZrN support layers for through-silicon vias

作者：Sten Vollebregt^a ; ^{s.vollebregt@tudelft.nl" class="auth_mail" title="E-mail the corresponding author} ; Sourish Banerjee^a ; ¹ ; Frans D. Tichelaar^b ; Ryoichi Ishihara^a

关键词：Carbon nanotubes ; Chemical vapour deposition ; Vertical interconnects ; Through silicon vias

刊名：Microelectronic Engineering

出版年：2016

6.Innovative polyimide liner deposition method for high-aspect-ratio and high-density through-silicon-vias (TSVs)

作者：Yingtao Ding ; Miao Xiong ; Yangyang Yan ; Shiwei Wang ; Qianwen Chen ; Weijing Wang ; ^{wangweijiang@bit.edu.cn" class="auth_mail" title="E-mail the corresponding author} ; Zhiming Chen

关键词：Liner ; Polyimide ; Through-silicon-vias (TSVs) ; Step coverage

刊名：Microelectronic Engineering

出版年：2016

7.Protrusion of electroplated copper filled in through silicon vias during annealing process

作者：Si Chen^a ; Fei Qin^a ; ^{qfei@bjut.edu.cn" class="auth_mail" title="E-mail the corresponding author} ; Tong An^a ; ^{antong@bjut.edu.cn" class="auth_mail" title="E-mail the corresponding author} ; Pei Chen^a ; Bin Xie^b ; Xunqing Shi^b

关键词：Through silicon vias ; Electroplated copper ; Protrusion ; Annealing ; Grain size

刊名：Microelectronics Reliability

出版年：2016

8.Measurement-based electrical characterization of through silicon vias and transmission lines for 3D integration

作者：Xin Sun^a ; Runiu Fang^a ; Yunhui Zhu^a ; Xiao Zhong^a ; Yuan Bian^a ; Yong Guan^a ; Min Miao^b ; Jing Chen^a ; Yufeng Jin^c ; ^a ; ^{yfjin@pku.edu.cn" class="auth_mail" title="E-mail the corresponding author}

关键词：3D integration ; Through silicon via (TSV) ; Transmission line ; Electrical measurement ; RF characterization

刊名：Microelectronic Engineering

出版年：2016

9.Dielectric liner reliability in via-middle through silicon vias with 3 Micron diameter

作者：Yunlong Li^a ; ^{yunlong.li@imec.be" class="auth_mail" title="E-mail the corresponding author} ; Stefaan Van Huylenbroeck^a ; Philippe Roussel^a ; Mohand Brouri^b ; Sanjay Gopinath^c ; Daniela M. Anjos^c ; Matthew Thorum^c ; Jengyi Yu^c ; Gerald P. Beyer^a ; Eric Beyne^a ; Kristof Croes^a

关键词：High aspect ratio through silicon via ; Sidewall roughness ; Atom Layer Deposition ; Dielectric reliability ; Local field enhancement ; Bimodal distribution

刊名：Microelectronic Engineering

出版年：2016

10.Thermally-induced failures of copper through-silicon via structures evaluated by the strain energy density model

作者：Chang-Fu Han^a ; Jen-Fin Lin^a ; ^b ; ^{jflin@mail.ncku.edu.tw" class="auth_mail" title="E-mail the corresponding author}

关键词：Through-silicon vias ; Current density ; Strain energy density

刊名：Thin Solid Films

出版年：2016

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