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内部出版物
SpringerLink电子期刊(46)
NATURE电子期刊(3)
Elsevier电子期刊(162)
在“
Elsevier电子期刊
”中,
命中:
162
条,耗时:0.0299845 秒
在所有数据库中总计命中:
211
条
1.
Theoretical prediction of thermodynamic activities of liquid Au-Sn-X (X=Bi, Sb, Zn)
solder
systems
作者:
O.E. Awe
a
;
b
;
draweoe2004@yahoo.com
;
O.M. Oshakuade
a
关键词:
Lead-free
solder
;
Au-Bi-Sn
;
Au-Sb-Sn
;
Au-Sn-Zn
;
Activity
;
High-temperature
solder
刊名:Physica B: Condensed Matter
出版年:2017
2.
Processing and mechanical behavior of Cu-Bi alloys with high
volume
fraction of Bi: Suitability for high temperature
solder
ing application
作者:
Binay Kumar Deb Barman
;
Shobhit Pratap Singh
;
Praveen Kumar
;
praveenk@materials.iisc.ernet.in" class="auth_mail" title="E-mail the corresponding author
关键词:
Cu-Bi alloy
;
High temperature
solder
s
;
Liquid phase sintering
;
Mechanical behavior
;
Microstructurally aware finite element analysis
刊名:Materials Science & Engineering A
出版年:2016
3.
Finite element analysis of the
effect
of process-induced voids on the fatigue lifetime of a lead-free
solder
joint under thermal cycling
作者:
Van Nhat Le
;
Lahouari Benabou
;
lahouari.benabou@uvsq.fr" class="auth_mail" title="E-mail the corresponding author
;
Victor Etgens
;
Quang Bang Tao
关键词:
Solder
joint
;
Void
effect
;
IGBT module
;
Polydisperse distribution
;
Thermo-mechanical reliability
;
Finite element analysis
刊名:Microelectronics Reliability
出版年:2016
4.
Multi-scale modeling of elasto-plastic response of SnAgCu lead-free
solder
alloys at different ageing conditions:
Effect
of microstructure evolution, particle size
effect
s and interfacial failure
作者:
Milad Maleki
;
Joel Cugnoni
;
joel.cugnoni@epfl.ch" class="auth_mail" title="E-mail the corresponding author
;
John Botsis
关键词:
Pb-free
solder
;
Microstructure-based simulation
;
Ageing
;
Intermetallics
;
Particle size
effect
;
Homogenization
刊名:Materials Science & Engineering A
出版年:2016
5.
Reinforcing cross-tension strength of adhesively bonded joints using metallic
solder
balls
作者:
XiaoBo Zhu
a
;
b
;
Xin Yang
c
;
YongBing Li
a
;
b
;
yongbinglee@sjtu.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Blair E. Carlson
d
关键词:
Epoxy/epoxides
;
Steels
;
Peel/cross-tension
;
Fracture
;
Solder
balls
刊名:International Journal of Adhesion and Adhesives
出版年:2016
6.
Effect
s of cobalt on the nucleation and grain refinement of Sn-3Ag-0.5Cu
solder
s
作者:
Z.L. Ma
;
z.ma13@imperial.ac.uk" class="auth_mail" title="E-mail the corresponding author
;
S.A. Belyakov
;
C.M. Gourlay
关键词:
Intermetallics
;
EBSD
;
Orientation relationship
;
Pb-free
solder
ing
;
Solidification
刊名:Journal of Alloys and Compounds
出版年:2016
7.
Nanoindentation study on micromechanical behaviors of Au-Ni-Sn intermetallic layers in Au-20Sn/Ni
solder
joints
作者:
Wensheng Liu
;
Yikai Wang
;
Yunzhu Ma
;
zhuzipm@csu.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Qiang Yu
;
Yufeng Huang
关键词:
Micromechanical properties
;
Nanoindentation
;
Au&ndash
;
20Sn
;
Intermetallics
刊名:Materials Science & Engineering A
出版年:2016
8.
Effect
of ILU dispensing types for different
solder
bump arrangements on CUF encapsulation process
作者:
Aizat Abas
a
;
aizatabas@usm.my" class="auth_mail" title="E-mail the corresponding author
;
Haslinda M.S.
a
;
M.H.H. Ishak
a
;
Nurfatin A.S.
a
;
M.Z. Abdullah
b
;
F. Che Ani
c
关键词:
Encapsulation process
;
Finite
volume
method
;
ILU dispensing
;
Ball grid array
刊名:Microelectronic Engineering
出版年:2016
9.
Electromigration mechanisms in Sn-0.7Cu/Cu couples by four dimensional (4D) X-ray microtomography and electron backscatter diffraction (EBSD)
作者:
J.C.E. Mertens
;
A. Kirubanandham
;
N. Chawla
;
nchawla@asu.edu" class="auth_mail" title="E-mail the corresponding author
关键词:
Pb-free
solder
;
Electromigration
;
X-ray tomography
;
Electron backscatter diffraction (EBSD)
;
Orientation image mapping (OIM)
刊名:Acta Materialia
出版年:2016
10.
Quality Assurance of Brazed Copper Plates through Advanced Ultrasonic NDE
作者:
Tiziana Segreto
a
;
b
;
tsegreto@unina.it" class="auth_mail" title="E-mail the corresponding author
;
Alessandra Caggiano
b
;
c
;
Roberto Teti
a
;
b
关键词:
Pure copper brazing
;
Quality assurance
;
Ultrasonic non-destructive evaluation
刊名:Procedia CIRP
出版年:2016
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