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内部出版物
SpringerLink电子期刊(6)
Elsevier电子期刊(30)
在“
Elsevier电子期刊
”中,
命中:
30
条,耗时:0.0430057 秒
在所有数据库中总计命中:
36
条
1.
Drop failure modes of Sn-3.0Ag-0.5Cu solder joints in
wafer
level
chip
scale
package
作者:
Ming-liang HUANG
a
;
huang@dlut.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Ning ZHAO
a
;
Shuang LIU
a
;
Yi-qian HE
b
关键词:
Sn&ndash
;
3.0Ag&ndash
;
0.5Cu
;
wafer
level
chip
scale
package
;
solder joint
;
drop failure mode
刊名:Transactions of Nonferrous Metals Society of China
出版年:2016
2.
Mixed-mode cohesive zone parameters for sub-micron
scale
stacked layers to predict microelectronic device reliability
作者:
Sathyanarayanan Raghavan
a
;
sathya@gatech.edu" class="auth_mail" title="E-mail the corresponding author
;
Ilko Schmadlak
b
;
George Leal
c
;
Suresh K. Sitaraman
a
关键词:
Cohesive zone modeling
;
Microelectronic
package
reliability
;
BEOL stack fracture
;
ULK cracking
刊名:Engineering Fracture Mechanics
出版年:2016
3.
Moisture absorption and desorption in
wafer
level
chip
scale
package
s
作者:
K. Rongen
a
;
kirsten.rongen@nxp.com" class="auth_mail" title="E-mail the corresponding author
;
A. Mavinkurve
a
;
M. Chen
b
;
P.J. van der Wel
a
;
F.H.M. Swartjes
a
;
R.T.H. Rongen
a
关键词:
Reliability
;
WLCSP
;
Preconditioning
;
Moisture
;
Reflow
;
Absorption
;
Desorption
刊名:Microelectronics Reliability
出版年:2015
4.
Anand model and FEM analysis of SnAgCuZn lead-free solder joints in
wafer
level
chip
scale
packaging devices
作者:
Liang Zhang
;
Ji-guang Han
;
Yonghuan Guo
;
Cheng-wen He
刊名:Microelectronics Reliability
出版年:January, 2014
5.
Process integration of fine pitch Cu redistribution wiring and SnCu micro-bumping for power efficient LSI devices with high-bandwidth stacked DRAM
作者:
Hirokazu Ezawa
a
;
c
;
hirokazu.ezawa@toshiba.co.jp
;
Takashi Togasaki
b
;
Tatsuo Migita
a
;
Soichi Yamashita
a
;
Masahiro Inohara
a
;
Yasuhiro Koshio
a
;
Masatoshi Fukuda
a
;
Masahiro Miyata
a
;
Kohei Tatsumi
c
关键词:
Semiconductor
;
3D interconnect
;
Low power consumption
;
Fine-pitch SnCu bumping
;
Fine-pitch Cu redistribution wiring
;
Chip
-on-
chip
joining
;
Intermetallic compound phase
刊名:Microelectronic Engineering
出版年:2013
6.
Wafer
-
level
chip
scale
packaging for piezoresistive pressure sensors using a dry-film shielding approach
作者:
Lung-Tai Chen
;
Wood-Hi Cheng
关键词:
Piezoresistive pressure sensor
;
Chip
scale
packaging
;
Dry-film
刊名:Sensors and Actuators A: Physical
出版年:2009
7.
Structural design optimization for board-
level
drop reliability of
wafer
-
level
chip
-
scale
package
s
作者:
Tsung-Yueh Tsai
;
Yi-Shao Lai
;
Chang-Lin Yeh
;
Rong-Sheng Chen
关键词:
Point and non-point sources
;
QUAL2E
;
River quality modelling
;
SWAT
;
Venice Lagoon Watershed (VLW)
刊名:Microelectronics Reliability
出版年:2008
8.
Characterizations of ball impact responses of
wafer
-
level
chip
-
scale
package
s
作者:
Yi-Shao Lai
;
Chang-Lin Yeh
;
Hsiao-Chuan Chang
;
Chin-Li Kao
关键词:
Ball impact test (BIT)
;
WLCSP
;
Impact force profile
;
Finite element analysis
刊名:Journal of Alloys and Compounds
出版年:2008
9.
Wafer
Level
Packaging Technology for Optical Imaging Sensors
作者:
H.-D. Ngo
;
J. Leib
关键词:
image sensors
;
wafer
level
chip
-
scale
packaging
;
TSV
;
TWV
;
back side contact
;
MEMS
刊名:Procedia Chemistry
出版年:2009
10.
Optimization for simulation of WL-CSP subjected to drop-test with plasticity behavior
作者:
Cé
;
dric Le Coq
a
;
b
;
c_le_coq@yahoo.fr"" rel=""nofollow
;
Adellah Tougui
b
;
abdellah.tougui@univ-tours.fr"" rel=""nofollow
;
Marie-Pa
scale
Stempin
a
;
Laurent Barreau
a
刊名:Microelectronics Reliability
出版年:2011
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