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在“
Elsevier电子期刊
”中,
命中:
14,123
条,耗时:0.1259392 秒
在所有数据库中总计命中:
20,767
条
1.
Superhydrophobic
copper
surface
s fabricated by fatty acid soaps in aqueous solution for excellent corrosion resistance
作者:
Wenlong Xu
;
Yuanyuan Hu
;
Wenda Bao
;
Xiaoyu Xie
;
Yiran Liu
;
Aixin Song
;
songaixin@sdu.edu.cn
;
Jingcheng Hao
关键词:
One-step immersing method
;
Aqueous solution
;
Copper
substrate
;
Superhydrophobic
surface
;
Corrosion resistance
刊名:Applied
Surface
Science
出版年:2017
2.
Superhydrophobic Cu
2
S@Cu
2
O film on
copper
surface
fabricated by a facile chemical bath deposition method and its application in oil-water separation
作者:
Pihui Pi
;
phpi@scut.edu.cn
;
Kun Hou
;
Cailong Zhou
;
Guidong Li
;
Xiufang Wen
;
Shouping Xu
;
Jiang Cheng
;
Shuangfeng Wang
关键词:
Copper
surface
;
Cu2S
;
Cu2O
;
Chemical bath deposition
;
Superhydrophobic
;
Oil-water separation
刊名:Applied
Surface
Science
出版年:2017
3.
Corrosion of
copper
in oxygen-deficient groundwater with and without deep bedrock micro-organisms: Characterisation of microbial communities and
surface
processes
作者:
E. Huttunen-Saarivirta
a
;
elina.huttunen-saarivirta@vtt.fi
;
P. Rajala
a
;
M. Bomberg
b
;
L. Carpé
;
n
a
关键词:
Microbiologically influenced corrosion (MIC)
;
Copper
;
Sulphate-reducing bacteria (SRB)
;
Biofilm
;
Corrosion
刊名:Applied
Surface
Science
出版年:2017
4.
The influence of crystal faces on corrosion behavior of
copper
surface
: First-principle and experiment study
作者:
Zhengwei Zhang
;
zzw_dxj@sohu.com
;
Qiang Wang
;
Xu Wang
;
Lin Gao
关键词:
Copper
;
Crystal face
;
Corrosion
;
First-principle
刊名:Applied
Surface
Science
出版年:2017
5.
Fabrication of durable superhydrophobic electrodeposited tin
surface
s with tremella-like structure on
copper
substrate
作者:
Ge He
;
Shixiang Lu
;
shixianglu@bit.edu.cn
;
Wenguo Xu
;
Jianying Yu
;
Bei Wu
;
Shuo Cui
关键词:
Tin
;
Copper
;
Electrodeposition
;
Superhydrophobic
刊名:
Surface
and Coatings Technology
出版年:2017
6.
Surface
void suppression for pure
copper
by high-speed laser scanner welding
作者:
Masanori Miyagi
a
;
masanori.miyagi.dc@hitachi.com" class="auth_mail" title="E-mail the corresponding author
;
Xudong Zhang
a
;
Yousuke Kawahito
b
;
Seiji Katayama
b
关键词:
Laser welding
;
Copper
;
Scanner
;
Surface
void
刊名:Journal of Materials Processing Technology
出版年:2017
7.
Evolution effects of the
copper
surface
morphology on the nucleation density and growth of graphene domains at different growth pressures
作者:
Seyed Mahdi Hedayat
a
;
Javad Karimi-Sabet
b
;
j_karimi@alum.sharif.edu
;
Mojtaba Shariaty-Niassar
a
;
mshariat@ut.ac.ir
关键词:
Cu
surface
morphology
;
Electropolishing
;
Graphene CVD growth
;
Nucleation density
;
Surface
evolution
;
Growth pressure
刊名:Applied
Surface
Science
出版年:2017
8.
The interaction between
copper
species and pyrite
surface
s in
copper
cyanide solutions
作者:
Bao Guo
;
Yongjun Peng
;
yongjun.peng@uq.edu.au
关键词:
Pyrite
;
Copper
cyanide
;
Copper
adsorption
;
Redox products
;
Flotation
刊名:International Journal of Mineral Processing
出版年:2017
9.
Soft X-ray absorption spectroscopy investigation of the
surface
chemistry and treatments of
copper
indium gallium diselenide (CIGS)
作者:
Craig Schwartz
a
;
b
;
Dennis Nordlund
a
;
Dimosthenis Sokaras
a
;
Miguel Contreras
c
;
Tsu-Chien Weng
a
;
d
;
Lorelle Mansfield
c
;
Katherine E. Hurst
c
;
Arrelaine Dameron
c
;
Kannan Ramanathan
c
;
David Prendergast
b
;
Steven T. Christensen
c
;
关键词:
Copper
-indium-gallium-selenide
;
CIGS
;
XAS
;
Chemical bath deposition
;
Surface
analysis
刊名:Solar Energy Materials and Solar Cells
出版年:2017
10.
Anti-corrosion film formed on HAl77-2
copper
alloy
surface
by aliphatic polyamine in 3 wt.% NaCl solution
作者:
Yinzhe Yu
;
Dong Yang
;
Daquan Zhang
;
zhdq@sh163.net" class="auth_mail" title="E-mail the corresponding author
;
zhangdaquan@shiep.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Yizhen Wang
;
Lixin Gao
关键词:
Copper
alloy
;
Corrosion
;
Electrochemical measurements
;
SEM
;
AFM
刊名:Applied
Surface
Science
出版年:2017
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