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在“
Elsevier电子期刊
”中,
命中:
578
条,耗时:0.0199632 秒
在所有数据库中总计命中:
761
条
1.
The properties of
Cu
metallization
based on CuMgAl alloy buffer layer
作者:
Zhinong Yu
a
;
znyu@bit.edu.cn
;
Jianshe Xue
b
;
Qi Yao
b
;
Zhengliang Li
b
;
Guanbao Hui
b
;
Wei Xue
a
关键词:
Cu
metallization
;
Cu
MgAl alloy
;
Resistivity
;
Adhesion
;
Diffusion
刊名:Microelectronic Engineering
出版年:2017
2.
Metallization
of Si heterojunction solar cells by nanosecond laser ablation and Ni-
Cu
plating
作者:
A. Dabirian
a
;
c
;
ali.dabirian@a3.epfl.ch" class="auth_mail" title="E-mail the corresponding author
;
A. Lachowicz
b
;
J.-W. Schü
;
ttauf
b
;
B. Paviet-Salomon
b
;
M. Morales-Masis
a
;
A. Hessler-Wyser
a
;
M. Despeisse
b
;
C. Ballif
a
;
b
关键词:
Laser material processing
;
Metallization
;
Electroplating
;
Heterojunction silicon solar cells
刊名:Solar Energy Materials and Solar Cells
出版年:2017
3.
A novel
metallization
process for soldering graphite to copper at low temperature
作者:
X.G. Song
a
;
b
;
xgsong@hitwh.edu.cn
;
J.H. Chai
b
;
S.P. Hu
b
;
J. Cao
a
;
J.C. Feng
a
;
b
;
D.Y. Tang
c
关键词:
Graphite
;
Metallization
;
Soldering
;
Microstructure
;
Mechanical properties
刊名:Journal of Alloys and Compounds
出版年:2017
4.
Electroless deposition of NiCrB diffusion barrier layer film for ULSI-
Cu
metallization
作者:
Yuechun Wang
a
;
Xiuhua Chen
a
;
chenxh@ynu.edu.cn
;
Wenhui Ma
b
;
Yudong Shang
a
;
Zhengtao Lei
a
;
Fuwei Xiang
a
关键词:
Electroless deposition
;
NiCrB thin film
;
Diffusion barrier layer
;
Failure mechanism
;
Annealing
刊名:Applied Surface Science
出版年:2017
5.
Mixed-phase Ni-Al as barrier layer against perovskite oxides to react with
Cu
for ferroelectric memory with Cu
metallization
作者:
J.H. Chen
a
;
X.H. Dai
a
;
C.R. Li
b
;
crli@zstu.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Y.L.
Cu
i
a
;
Q.X. Zhao
a
;
J.X. Guo
a
;
X.H. Li
c
;
X.Y. Zhang
c
;
Y.L. Wang
a
;
L.X. Ma
d
;
B.T. Liu
a
;
btliu@hbu.cn" class="auth_mail" title="E-mail the corresponding author
关键词:
Ferroelectric capacitor
;
Cu
metallization
;
Barrier layer
;
Ni&ndash
;
Al
;
Failure mechanism
;
Interfaces
刊名:Journal of Alloys and Compounds
出版年:2016
6.
Influence of the
Cu
2
O morphology on the
metallization
of Al
2
O
3
ceramics
作者:
Jing-Wu Zheng
;
zhengjw@zjut.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Deng-Ming Gao
;
Liang Qiao
;
Yao Ying
;
Wang-Chang Li
;
Li-Qiang Jiang
;
Sheng-Lei Che
关键词:
Cu
2O film
;
Electro-deposition
;
Metallization
;
Al2O3 ceramic
;
Bonding strength
刊名:Surface and Coatings Technology
出版年:2016
7.
N
2
O plasma treatment for minimization of background plating in silicon solar cells with Ni-
Cu
front side
metallization
作者:
Mehul C. Raval
a
;
b
;
mehul.c.raval@iitb.ac.in" class="auth_mail" title="E-mail the corresponding author
;
Sandeep S. Saseendran
a
;
c
;
Stephan Suckow
d
;
S. Saravanan
a
;
Chetan S. Solanki
a
;
b
;
Anil Kottantharayil
a
;
c
关键词:
Ni&ndash
;
Cu
metallization
;
Background plating
;
Local ideality factor
;
N2O plasma treatment
刊名:Solar Energy Materials and Solar Cells
出版年:2016
8.
Laser-direct process of
Cu
nano-ink to coat highly conductive and adhesive
metallization
patterns on plastic substrate
作者:
Hyungsuk Min
a
;
Byoungyoon Lee
b
;
Sooncheol Jeong
b
;
Myeongkyu Lee
a
;
myeong@yonsei.ac.kr" class="auth_mail" title="E-mail the corresponding author
关键词:
Cu
;
Nano-ink
;
Laser sintering
;
Patterning
;
Flexible substrate
刊名:Optics and Lasers in Engineering
出版年:2016
9.
Metallization
of carbon fiber reinforced polymers: Chemical kinetics, adhesion, and properties
作者:
Fouzi Addou
a
;
fouzi.addou@ensiacet.fr
;
Thomas Duguet
a
;
Piera Bosso
b
;
Anne Zhang
a
;
Eliane Amin-Chalhoub
a
;
Fiorenza Fanelli
c
;
Constantin Vahlas
a
关键词:
Epoxy/C fibers composite
;
Metallization
;
Adherence
;
MOCVD
;
Cu
刊名:Surface and Coatings Technology
出版年:2016
10.
Evaluation of
Cu
(V) self-forming barrier for Cu
metallization
作者:
Fei Cao
;
caofei1982@yahoo.com" class="auth_mail" title="E-mail the corresponding author
;
Gao-hui Wu
wugh@hit.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Long-tao Jiang
关键词:
Copper
;
Alloy
;
Diffusion barrier
;
Self-forming
;
Annealing
刊名:Journal of Alloys and Compounds
出版年:2016
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