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Wiley电子期刊(7)	SpringerLink电子期刊(383)	NATURE电子期刊(11)	ACS电子期刊(38)
Springer电子图书(21)	ProQuest学位论文(16)	Elsevier电子期刊(724)

在“Elsevier电子期刊”中，命中：724条，耗时：0.0189938 秒

在所有数据库中总计命中：1,200条

1.Investigation of soldering process and interfacial microstructure evolution for the formation of full Cu₃Sn joints in electronic packaging

作者：Peng Yao ; ^{kaka3778@126.com} ; Xiaoyan Li ; Xiaobo Liang ; Bo Yu

关键词：Electronic packaging ; Full Cu3Sn joints ; Soldering temperature ; Soldering pressure ; Soldering time ; Interfacial microstructure evolution

刊名：Materials Science in Semiconductor Processing

出版年：2017

2.Preparation of nanoparticle and nanowire mixed pastes and their low temperature sintering

作者：Wei Guo^a ; Hongqiang Zhang^b ; ^c ; Xiaoying Zhang^a ; Lei Liu^b ; ^c ; ^{liulei@tsinghua.edu.cn" class="auth_mail" title="E-mail the corresponding author} ; Peng Peng^a ; Guisheng Zou^b ; ^c ; ^{zougsh@tsinghua.edu.cn" class="auth_mail" title="E-mail the corresponding author} ; Y.Norman Zhou^b ; ^d

关键词：Mixed nano paste ; Sintering ; Electrochemical migration ; Electronic packaging

刊名：Journal of Alloys and Compounds

出版年：2017

3.Microstructure and thermal expansion behavior of Al-50Si synthesized by selective laser melting

作者：Y.D. Jia^a ; ^b ; P. Ma^c ; K.G. Prashanth^b ; G. Wang^a ; J. Yi^a ; S. Scudino^d ; F.Y. Cao^e ; J.F. Sun^e ; J. Eckert^b ; ^f ; ^{juergen.eckert@unileoben.ac.at}

关键词：Selective laser melting (SLM) ; Al-50Si alloy ; Microstructure ; Solid solution ; Thermal expansion

刊名：Journal of Alloys and Compounds

出版年：2017

4.Accurate AOI inspection of resistance in LCD Anisotropic Conductive Film bonding using differential interference contrast

作者：Guangming Ni ; ^{kinyngm@163.com} ; Lin Liu ; Xiaohui Du ; Jing Zhang ; Juanxiu Liu ; Yong Liu

关键词：Anisotropic Conductive Film ; Conductive microspheres ; Differential interference contrast ; Resistance ; Automated optical inspection

刊名：Optik - International Journal for Light and Electron Optics

出版年：2017

5.A minimal model for solvent evaporation and absorption in thin films

作者：Matthew G. Hennessy ; ^{m.hennessy@imperial.ac.uk} ; Giulia L. Ferretti ^{giulia.ferretti08@imperial.ac.uk} ; Joã ; o T. Cabral ^{j.cabral@imperial.ac.uk} ; Omar K. Matar ; ^{o.matar@imperial.ac.uk}

关键词：Thin films ; Evaporation ; Sorption ; Desorption ; Diffusion ; Skin formation ; Saturation front ; Mathematical model ; Asymptotic analysis

刊名：Journal of Colloid and Interface Science

出版年：2017

6.Investigation of dielectric properties and microstructure of sintered 13·2Li₂O − 67·6SiO₂ − 14.49Al₂O₃ − 3·3TiO₂ − 0.4BaO − 0.97ZnO glass-ceramics

作者：Hamidreza Savabieh^a ; ^b ; ^{H.Savabieh@modares.ac.ir" class="auth_mail" title="E-mail the corresponding author} ; Parvin Alizadeh^a ; Yadira Arroyo Rojas Dasilva^c ; Rolf Erni^c ; Frank Jö ; rg Clemens^b

关键词：Glass-ceramics sintering ; Water absorption ; Lithium aluminosilicate ; Dielectric properties ; Microstructure

刊名：Journal of the European Ceramic Society

出版年：2017

7.Using Taguchi method to obtain the optimal design of heat dissipation mechanism for electronic component packaging

作者：De-Shau Huang^a ; Wen-Bin Tu^b ; Xiu-Ming Zhang^b ; Liang-Te Tsai^b ; Ti-Yuan Wu^b ; Ming-Tzer Lin^b ; ^{mingtlin@nchu.edu.tw" class="auth_mail" title="E-mail the corresponding author}

关键词：Electronic component packaging ; Thermal stress ; Finite element method ; Taguchi method

刊名：Microelectronics Reliability

出版年：2016

8.Experimental and Numerical Study of Natural Convection for High Powered and Wire-Bonded QFN64b Electronic Device

作者：A. Baï ; ri ; ^{abairi@u-paris10.fr" class="auth_mail" title="E-mail the corresponding author} ; ^{bairi.a@gmail.com" class="auth_mail" title="E-mail the corresponding author} ; J.-G. Bauzin ; N. Alilat

关键词：Electronics ; Thermal control ; Natural convection ; High powered QFN64b ; Wire-bonding technique ; Electronic packaging ; Convective heat transfer coefficient ; Correlations

刊名：International Communications in Heat and Mass Transfer

出版年：2016

9.Microstructures and properties of Al-50%SiC composites for electronic packaging applications

作者：Fei TENG^a ; ^b ; Kun YU^a ; ^b ; ^{yukun2010@csu.edu.cn" class="auth_mail" title="E-mail the corresponding author} ; Jie LUO^a ; Hong-jie FANG^a ; Chun-li SHI^a ; Yi-long DAI^b ; Han-qing XIONG^b

关键词：Al&ndash ; 50%SiC composites ; powder metallurgy ; thermal properties ; flexural strength ; electronic packaging material

刊名：Transactions of Nonferrous Metals Society of China

出版年：2016

10.Free convective heat transfer for the wire-bonded and low powered QFN64b electronic device

作者：A. Baï ; ri

关键词：Electronics ; Thermal control ; Natural convection ; Low powered QFN64b ; Wire-bonding technique ; Electronic packaging ; Convective heat transfer coefficient ; Correlations

刊名：International Communications in Heat and Mass Transfer

出版年：2016

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