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Elsevier电子期刊(4)
在“
Elsevier电子期刊
”中,
命中:
4
条,耗时:0.0109944 秒
在所有数据库中总计命中:
4
条
1.
The effect of electro-thermal parameters on
IGBT
junction temperature with the
aging
of
module
作者:
Lingling Li
a
;
b
;
Yahui Xu
a
;
Zhigang Li
a
;
747991766@qq.com
;
Pengchong Wang
a
;
Bing Wang
c
关键词:
IGBT
module
aging
;
Power thermal cycle
;
Electro-thermal parameter
;
Junction temperature
刊名:Microelectronics Reliability
出版年:2016
2.
Monitoring chip fatigue in an
IGBT
module
based on grey relational analysis
作者:
Shengqi Zhou
a
;
shengqi.z@cqu.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Luowei Zhou
b
;
Litao Yu
a
;
Sucheng Liu
c
;
Quanming Luo
b
;
Pengju Sun
b
;
Junke Wu
b
关键词:
Power electronics
;
Insulated gate bipolar transistor (
IGBT
)
;
Reliability
;
Chip fatigue
;
Grey relational analysis (GRA)
刊名:Microelectronics Reliability
出版年:2016
3.
Power cycling testing and FE modelling focussed on Al wire bond fatigue in high power
IGBT
module
s
作者:
O. Schilling
;
M. Sch?fer
;
K. Mainka
;
M. Thoben
;
F. Sauerl
刊名:Microelectronics Reliability
出版年:2012
4.
Field failure mechanism and improvement of EOS failure of integrated
IGBT
inverter
module
s
作者:
Jae-Seong Jeong
;
Soon-Ha Hong
;
Sang-Deuk Park
关键词:
Adaptive search space
;
Genetic algorithms
;
Hysteresis identification
;
Actuator hysteresis compensation
刊名:Microelectronics Reliability
出版年:2007
1
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2007年(1)
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