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内部出版物
Wiley电子期刊(1)
SpringerLink电子期刊(15)
Elsevier电子期刊(5)
ACS电子期刊(1)
在“
Elsevier电子期刊
”中,
命中:
5
条,耗时:小于0.01 秒
在所有数据库中总计命中:
22
条
1.
Fracture reliability concern of (Au, Ni)Sn
4
phase in 3D integrated circuit microbumps using Ni/Au surface finishing
作者:
Yingxia Liu
a
;
Yi-Ting Chen
a
;
Sam Gu
b
;
Dong-Wook Kim
b
;
K.N. Tu
a
;
kntu@ucla.edu" class="auth_mail" title="E-mail the corresponding author
关键词:
Crack
;
Kirkendall voids
;
Microbump
;
Reliability
;
(Au
;
Ni)
Sn4
刊名:Scripta Materialia
出版年:2016
2.
Study of electromigration resistance of (Pd,Ni)Sn
4
phase in lead-free solder joints
作者:
Chao-hong Wang
;
chmchw@ccu.edu.tw" class="auth_mail" title="E-mail the corresponding author
;
Kuan-ting Li
关键词:
Electromigration
;
Intermetallics
;
Interface
;
Pd
Sn4
;
Lead-free solders
刊名:Journal of Alloys and Compounds
出版年:2016
3.
Interfacial reaction of Ni
3
Sn
4
intermetallic compound in Ni/SnAg solder/Ni system under thermomigration
作者:
Yi-Shan Yang
;
Chia-Jung Yang
;
Fan-Yi Ouyang
;
fyouyang@ess.nthu.edu.tw" class="auth_mail" title="E-mail the corresponding author
关键词:
Pb-free solders
;
Ni3
Sn4
intermetallic compound
;
Metals and alloys
;
Diffusion
;
Liquid&ndash
;
solid reactions
;
Temperature gradient
刊名:Journal of Alloys and Compounds
出版年:2016
4.
Role of Fe impurities in the nucleation of metastable
NiSn
4
作者:
S.A. Belyakov
;
s.belyakov09@imperial.ac.uk
;
C.M. Gourlay
关键词:
A. Intermetallics
;
miscellaneous
;
B. Phase transformation
;
C. Crystal growth
;
D. Phase interfaces
;
F. Electron microscopy
;
scanning
刊名:Intermetallics
出版年:2013
5.
Solder Volume Effect on the Microstructure of Solder Joints Using Au/Pd(P)/Ni(P) Surface Finish
作者:
Wei–
;
Hsiang Wu
;
Sheng–
;
Wei Lin
;
Yen–
;
Chen Lin
;
Cheng–
;
En Ho
;
ceho1975@hotmail.com
关键词:
Sn3Ag0.5Cu
;
Au/Pd(P)/Ni(P)
;
Cu concentration
;
Pd concentration
;
solder volume effect
;
(Pd
;
Ni)
Sn4
刊名:Procedia Engineering
出版年:2012
1
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