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Wiley电子期刊(3)
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在“
Elsevier电子期刊
”中,
命中:
251
条,耗时:0.0119985 秒
在所有数据库中总计命中:
415
条
1.
Effects of magnetic field distributions on
wire
saw
ing performance
作者:
Wei Zhang
;
Xuefeng Xu
;
Tengwei Qiu
;
Chunyan Yao
;
ycy@zjut.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Wei Peng
关键词:
Free-abrasive
wire
saw
ing
;
Magnetic abrasive grains
;
Magnetic field
;
Wire
saw
ing performance
刊名:Precision Engineering
出版年:2017
2.
Subsurface crack damage in silicon wafers induced by resin bonded diamond
wire
saw
ing
作者:
Tengyun Liu
a
;
lty198614@163.com" class="auth_mail" title="E-mail the corresponding author
;
Peiqi Ge
a
;
b
;
pqge@sdu.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Wenbo Bi
a
;
b
;
biwenbo@sdu.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Yufei Gao
a
;
b
;
yfgao@sdu.edu.cn" class="auth_mail" title="E-mail the corresponding author
关键词:
Resin bonded diamond
wire
saw
;
Silicon wafer
;
Subsurface crack damage
刊名:Materials Science in Semiconductor Processing
出版年:2017
3.
Wire
saw
cutting model development and performance investigation for vibration reduced tunnel excavation
作者:
Jin-Ho Lee
;
jinholee@krri.re.kr
;
Sung-Kwon Ahn
;
Kyoung-Chan Lee
;
Choon-Seok Bang
;
Jin-Hyung Cho
;
Myung Sagong
关键词:
Wire
saw
;
Blast vibration
;
Tunnel excavation
;
Cutting model
;
Cutting performance
刊名:Tunnelling and Underground Space Technology
出版年:2017
4.
High frequency passive micro-magnetic sensor based on surface acoustic wave transponder and giant magnetoimpedance sensitive element
作者:
Peng Zhang
a
Author Vitae
;
Hong Hu
a
;
honghu@hit.edu.cn
Author Vitae
;
Fayyaz Muhammad
a
;
b
Author Vitae
;
Yulin Lei
a
Author Vitae
关键词:
Magnetic sensor
;
SAW
transponder
;
GMI
;
Amorphous
wire
刊名:Sensors and Actuators A: Physical
出版年:2017
5.
Wire
saw
ing technology: A state-of-the-art review
作者:
Hao Wu
;
pingchina85@gmail.com" class="auth_mail" title="E-mail the corresponding author
关键词:
Wire
saw
ing
;
Diamond
wire
saw
ing
;
Modeling
;
Material removal
;
Indentation
;
Scribing
刊名:Precision Engineering
出版年:2016
6.
Experiment study on electroplated diamond
wire
saw
slicing single-crystal silicon
作者:
Yufei Gao
;
yfgao@sdu.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Peiqi Ge
;
Tengyun Liu
关键词:
Electroplated diamond
wire
;
Wire
saw
machining
;
Single-crystal silicon
;
Wafer slicing
;
Wafer quality
刊名:Materials Science in Semiconductor Processing
出版年:2016
7.
Effect of Diamond
Wire
Saw
Marks on Solar Cell Performance
作者:
Hubert Seigneur
a
;
b
;
c
;
Hubert.Seigneur@uspvmc.org" class="auth_mail" title="E-mail the corresponding author
;
Eric J. Schneller
a
;
b
;
Narendra S. Shiradkar
a
;
d
;
Winston V. Schoenfeld
a
;
b
;
c
关键词:
Silicon solar cell
;
Diamond
wire
saw
;
Ingot
;
Photoluminescence
;
Quantum efficiency
;
Spatially resolved loss analysis
刊名:Energy Procedia
出版年:2016
8.
Source of boron and phosphorus impurities in the silicon
wiresaw
ing slurry and their removal by acid leaching
作者:
Suning Liu
;
Kai Huang
;
khuang@metall.ustb.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Hongmin Zhu
;
hzhu@metall.ustb.edu.cn" class="auth_mail" title="E-mail the corresponding author
关键词:
Silicon
wiresaw
ing slurry
;
Boron and phosphorus
;
Source
;
Recovery
;
Acid leaching
刊名:Separation and Purification Technology
出版年:2017
9.
On the mechanism of the vapor etching of diamond
wire
saw
n multi-crystalline silicon wafers for texturing
作者:
Zhigang Xiao
;
Guoying Geng
;
Xiuqin Wei
;
Zhihao Yue
;
Lang Zhou
;
lzhou@ncu.edu.cn" class="auth_mail" title="E-mail the corresponding author
关键词:
Vapor etching
;
Texturization
;
Diamond
wire
saw
;
Multi-crystalline silicon wafer
刊名:Materials Science in Semiconductor Processing
出版年:2016
10.
Uncertainty-aware frequency estimation algorithm for passive
wire
less resonant
SAW
sensor measurement
作者:
Boquan Liu
;
laubor@yeah.net" class="auth_mail" title="E-mail the corresponding author
Author Vitae
;
Yicheng ZengAuthor Vitae
关键词:
Passive
wire
less
;
SAW
sensor
;
Uncertainty-aware
;
Frequency estimation
刊名:Sensors and Actuators A: Physical
出版年:2016
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