设为首页
收藏本站
网站地图
|
English
|
公务邮箱
About the library
Background
History
Leadership
Organization
Readers' Guide
Opening Hours
Collections
Help Via Email
Publications
Electronic Information Resources
常用资源
电子图书
期刊论文
学位会议
外文资源
特色专题
内部出版物
在“
Elsevier电子期刊
”中,
命中:
4
条,耗时:0.1469316 秒
1.
Effect of ultrasonic transmission rate on microstructure and properties of the ultrasonic-assisted brazing of Cu to alumina
作者:
Hongjun Ji
a
;
b
;
jh
j7005
@hit.edu.cn"
class
="auth_
mail
"
title
="E-
mail
the
corresponding
author
;
Hao Chen
a
;
Mingyu Li
a
;
b
;
myli@hit.edu.cn"
class
="auth_
mail
"
title
="E-
mail
the
corresponding
author
关键词:
Ceramics
;
Ultrasonic brazing
;
Microstructure
;
Shear strength
;
Heat dissipation
刊名:Ultrasonics Sonochemistry
出版年:2017
2.
Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn-0.7Cu solder for high temperature packaging application
作者:
Hongjun Ji
;
jh
j7005
@hit.edu.cn"
class
="auth_
mail
"
title
="E-
mail
the
corresponding
author
;
Yunfei Qiao
;
Mingyu Li
;
myli@hit.edu.cn"
class
="auth_
mail
"
title
="E-
mail
the
corresponding
author
关键词:
Ultrasonic-assisted soldering
;
Die bonding
;
Microstructure
;
Intermetallic joint
;
Thermal conductivity
刊名:Scripta Materialia
出版年:2016
3.
Ultrafast ultrasonic-assisted joining of bare α-alumina ceramics through reaction wetting by aluminum filler in air
作者:
Hongjun Ji
;
jh
j7005
@hit.edu.cn"
class
="auth_
mail
"
title
="E-
mail
the
corresponding
author
;
Xiao Cheng
;
Mingyu Li
;
myli@hit.edu.cn"
class
="auth_
mail
"
title
="E-
mail
the
corresponding
author
关键词:
α-Alumina ceramics
;
Ultrasonic-assisted joining
;
Wetting
;
Microstructure
;
Mechanical property
刊名:Journal of the European Ceramic Society
出版年:2016
4.
Ni
3
Sn
4
-composed die bonded interface rapidly formed by ultrasonic-assisted soldering of Sn/Ni solder paste for high-temperature power device packaging
作者:
Hongjun Ji
;
jh
j7005
@hit.edu.cn"
class
="auth_
mail
"
title
="E-
mail
the
corresponding
author
;
Minggang Li
;
Shu Ma
;
Mingyu Li
myli@hit.edu.cn"
class
="auth_
mail
"
title
="E-
mail
the
corresponding
author
关键词:
Ultrasonic-assisted bonding
;
Die bonding
;
Tin-nickel compounds
;
Power electronics
;
Interconnections
;
Aging
刊名:Materials & Design
出版年:2016
1
按检索点细分(4)
作者(4)
按出版年细分(4)
2017年(1)
2016年(3)
NGLC 2004-2010.National Geological Library of China All Rights Reserved.
Add:29 Xueyuan Rd,Haidian District,Beijing,PRC. Mail Add: 8324 mailbox 100083
For exchange or info please contact us via
email
.