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在“Elsevier电子期刊”中，命中：5条，耗时：小于0.01 秒

1.Influence of Ce addition on Sn-3.0Ag-0.5Cu solder joints: Thermal behavior, microstructure and mechanical properties

作者：Xiaoxuan Tu^a ; ^b ; Danqing Yi^a ; ^b ; Jing Wu^c ; Bin Wang^a ; ^b ; ^{wangbin325@263.net}

关键词：SAC305-xCe solder joints ; Thermal behavior ; Intermetallic compounds evolution ; Mechanical properties

刊名：Journal of Alloys and Compounds

出版年：2017

2.Influence of electric field on microstructure and mechanical properties of an Al-Cu-Li alloy during ageing

作者：Wenbin Shou^a ; Danqing Yi^a ; ^b ; Ruowei Yi^a ; Huiqun Liu^a ; Zihao Bao^a ; Bin Wang^a ; ^b ; ^{wangbin325@263.net" class="auth_mail" title="E-mail the corresponding author}

关键词：Microstructure ; Segregation ; Precipitation ; Electric field ; Al-Cu-Li alloy

刊名：Materials & Design

出版年：2016

3.Effect of grain size on the fatigue crack growth behavior of 2524-T3 aluminum alloy

作者：W.B. Shou^a ; D.Q. Yi^a ; ^b ; H.Q. Liu^a ; C. Tang^a ; F.H. Shen^a ; B. Wang^a ; ^b ; ^{wangbin325@263.net" class="auth_mail" title="E-mail the corresponding author}

关键词：Aluminum alloys ; Fatigue crack growth ; Crack closure ; Crack deflection ; Grain size

刊名：Archives of Civil and Mechanical Engineering

出版年：2016

4.Effects of heating rate during solid-solution treatment on microstructure and fatigue properties of AA2524 T3 Al-Cu-Mg sheet

作者：Fanghua Shen^a ; ^c ; Bin Wang^a ; ^{wangbin325@263.net" class="auth_mail" title="E-mail the corresponding author} ; Danqing Yi^a ; ^b ; ^c ; ; Huiqun Liu^a ; Cong Tang^a ; Wenbin Shou^a

关键词：Aluminum alloy ; Heating rates ; Recrystallization mechanisms ; Fatigue crack growth ; Crack closure

刊名：Materials & Design

出版年：2016

5.Non-isothermal oxidation kinetics of WC-6Co cemented carbides in air

作者：Liyong Chen ; Bin Wang ; ^{wangbin325@263.net} ; Danqing Yi ; Huiqun Liu

关键词：WC&ndash ; 6Co ; Non-isothermal oxidation ; Kinetic

刊名：International Journal of Refractory Metals and Hard Materials

出版年：2013

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