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在“Elsevier电子期刊”中，命中：569条，耗时：0.0209895 秒

在所有数据库中总计命中：4,755条

1.Influence of SAP content and curing age on air void distribution of high performance concrete using 3D volume analysis

作者：Babatunde J. Olawuyi^a ; ^{babatunde@futminna.edu.ng} ; William P. Boshoff^b ; ^{bboshoff@sun.ac.za}

关键词：Computed tomography (CT) scanning ; 3D-void analysis ; High-performance concrete ; Air void distribution ; Superabsorbent Polymers (SAP) ; SAP content ; Binder type ; Curing age

刊名：Construction and Building Materials

出版年：2017

2.Design of electrode arrays for 3D capacitance tomography in a planar domain

作者：Stephen H. Taylor^a ; ^b ; Suresh V. Garimella^a ; ^{sureshg@purdue.edu}

关键词：Image reconstruction ; 3D capacitance tomography ; Optimized design ; Electrode design

刊名：International Journal of Heat and Mass Transfer

出版年：2017

3.Investigation into the effects of two component grout properties on surface settlements

作者：Mohammad Sharghi^a ; Hamid Chakeri^a ; Yilmaz Ozcelik^b ; ^{yilmaz@hacettepe.edu.tr}

关键词：Shield tunneling ; Annular gap ; Two component grout ; Grout properties ; Surface settlement ; FLAC3D

刊名：Tunnelling and Underground Space Technology

出版年：2017

4.Two-dimensional (2D), three-dimensional static (3D) and real-time (4D) contrast enhanced voiding urosonography (ceVUS) versus voiding cystourethrography (VCUG) in children with vesicoureteral reflux.

作者：Magdalena Maria Woźniak^a ; ^{mwozniak@hoga.pl" class="auth_mail" title="E-mail the corresponding author} ; Andrzej Paweł Wieczorek^a ; Agata Pawelec^a ; Agnieszka Brodzisz^a ; Maria Małgorzata Zajączkowska^b ; Halina Borzęcka^b ; Paweł Nachulewicz^c

关键词：ceVUS ; contrast enhanced voiding urosonography ; ESPR ; European society of paediatric radiology ; ESUR ; European society of urogenital radiology ; PUU ; pelvi-ureteral unit ; US ; ultrasound ; VCUG ; voiding cystourethrography ; VUR ; vesicoureteral reflux ; 3D ; three-dimensional ; 4D ; four-dimensional

刊名：European Journal of Radiology

出版年：2016

5.Effect of phase separation on mechanical strength of co-sputtering Cu(Ti) thin film in chip-level 3DIC bonding

作者：Po Chen Lin ; Hao Chen ; Hsien-Chien Hsieh ; Albert T. Wu ; ^{atwu@ncu.edu.tw}

关键词：Electronic materials ; Sputtering ; Phase separation ; Cu bonding ; Co-sputtered Cu(Ti) ; Shear test

刊名：Materials Letters

出版年：2017

6.Discrete element simulation and experimental study of powder spreading process in additive manufacturing

作者：S. Haeri^a ; ^{sina.haeri@strath.ac.uk} ; Y. Wang^b ; ^{Y.Wang@exeter.ac.uk} ; O. Ghita^b ; ^{O.Ghita@exeter.ac.uk} ; J. Sun^c ; ^{j.sun@ed.ac.uk}

关键词：Additive manufacturing ; Discrete element method ; Laser sintering ; 3D printing ; Powder spreading

刊名：Powder Technology

出版年：2017

7.Volumetric parametrization from a level set boundary representation with PHT-splines

作者：Chiu Ling Chan^c ; Cosmin Anitescu^c ; Timon Rabczuk^a ; ^b ; ^c ; ^{timon.rabczuk@tdt.edu.vn}

关键词：Volumetric parametrization ; Boundary representation ; PHT-splines ; Level set method

刊名：Computer-Aided Design

出版年：2017

8.Surface-etched halloysite nanotubes in mixed matrix membranes for efficient gas separation

作者：Lei Ge^a ; Rijia Lin^a ; Li Wang^a ; Thomas E. Rufford^a ; Byron Villacorta^a ; Shaomin Liu^b ; Lian X. Liu^c ; Zhonghua Zhu^a ; ^{z.zhu@uq.edu.au" class="auth_mail" title="E-mail the corresponding author}

关键词：Mixed matrix membranes ; Surface modification ; Interfacial defects ; Halloysite nanotubes

刊名：Separation and Purification Technology

出版年：2017

9.Effects of anisotropic voids on thermal properties of insulating media investigated using 3D printed samples

作者：Sang-Yeop Chung^a ; ^{sychung419@gmail.com" class="auth_mail" title="E-mail the corresponding author} ; Dietmar Stephan^a ; Mohamed Abd Elrahman^a ; ^c ; Tong-Seok Han^b

关键词：Insulating media ; Anisotropy ; Void distribution ; Probabilistic characteristics ; Thermal conductivity ; Directional stiffness

刊名：Construction and Building Materials

出版年：2016

10.Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling

作者：Yuan-Wei Chang^a ; ^b ; ^{aone.chang@gmail.com" class="auth_mail" title="E-mail the corresponding author} ; Yin Cheng^a ; ^c ; ^{yin.cheng@gmx.com" class="auth_mail" title="E-mail the corresponding author} ; Feng Xu^a ; Lukas Helfen^a ; ^c ; ^d ; ^{lukas.helfen@kit.edu" class="auth_mail" title="E-mail the corresponding author} ; Tian Tian^e ; Marco Di Michiel^d ; Chih Chen^b ; King-Ning Tu^e ; Tilo Baumbach^a ; ^c

关键词：Electromigration ; Flip-chip ; Laminography ; Synchrotron radiation ; Finite-element modeling

刊名：Acta Materialia

出版年：2016

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