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Springer电子图书(1)
CNKI会议论文(1)
CNKI学位论文(611)
知网期刊论文(359)
在“
Elsevier电子期刊
”中,
命中:
345
条,耗时:小于0.01 秒
在所有数据库中总计命中:
972
条
1.
Effect of surface preparation of
copper
on spin-coating driven self- assembly of fullerene molecules
作者:
Dongni Ma
a
;
Selene Sandoval
b
;
Krishna Muralidharan
b
;
krishna@u.arizona.edu
;
Srini Raghavan
a
;
b
关键词:
Self-assembly
;
Fullerene
;
Graphene
;
Copper
;
Interconnects
刊名:Microelectronic Engineering
出版年:2017
2.
Printed
interconnects
for photovoltaic modules
作者:
J.D. Fields
a
;
G. Pach
a
;
b
;
K.A.W. Horowitz
a
;
T.R. Stockert
a
;
c
;
M. Woodhouse
a
;
M.F.A.M. van Hest
a
;
maikel.van.hest@nrel.gov" class="auth_mail" title="E-mail the corresponding author
关键词:
Thin-film photovoltaics
;
Module construction
;
Monolithic
interconnects
;
Printing
刊名:Solar Energy Materials and Solar Cells
出版年:2017
3.
Cu-Mn-Co oxides as protective materials in SOFC technology: The effect of chemical composition on mechanochemical synthesis, sintering behaviour, thermal expansion and electrical conductivity
作者:
Andrea Masi
a
;
b
;
c
;
andrea.masi@enea.it" class="auth_mail" title="E-mail the corresponding author
;
Mariangela Bellusci
a
;
Stephen J. McPhail
a
;
Franco Padella
a
;
Priscilla Reale
a
;
Jong-Eun Hong
b
;
Robert Steinberger-Wilckens
b
;
Maurizio Carlini
c
关键词:
Spinel oxides
;
Ball milling
;
Thermal expansion
;
Solid oxide fuel cell
;
Interconnect coating
刊名:Journal of the European Ceramic Society
出版年:2017
4.
Critical Temperature Shift for Stress Induced Voiding in Advanced Cu
Interconnects
for 32 nm and Beyond
作者:
Rao Morusupalli
a
;
R. Rao
b
;
Tae-Kyu Lee
a
;
Yu-Lin Shen
c
;
M. Kunz
d
;
N. Tamura
d
;
A.S. Budiman
e
;
suriadi@alumni.stanford.edu" class="auth_mail" title="E-mail the corresponding author
关键词:
Copper
;
Interconnects
;
Stress Induced Voiding
;
Stress Migration
;
Reliability
;
Plastic Deformation
;
Modeling
;
FEM
刊名:Procedia Engineering
出版年:2016
5.
Long term high temperature oxidation characteristics of La and Cu alloyed ferritic stainless steels for solid oxide fuel cell
interconnects
作者:
Srinivasan Swaminathan
;
swaminathan@kist.re.kr" class="auth_mail" title="E-mail the corresponding author
;
srini.snsharma@gmail.com" class="auth_mail" title="E-mail the corresponding author
;
Young-Su Lee
;
Dong-Ik Kim
;
dongikkim@kist.re.kr" class="auth_mail" title="E-mail the corresponding author
;
dongikkim@gmail.com" class="auth_mail" title="E-mail the corresponding author
关键词:
SOFC metallic
interconnects
;
Ferritic stainless steels
;
Oxidation
;
Copper
;
Lanthanum
刊名:Journal of Power Sources
出版年:2016
6.
A model for statistical electromigration simulation with dependence on capping layer and Cu microstructure in two dimensions
作者:
Matthias Kraatz
a
;
;
Martin Gall
a
;
Ehrenfried Zschech
a
;
Dieter Schmeisser
b
;
Paul S. Ho
c
关键词:
Electromigration
;
Grain growth
;
Computer simulation
;
2D
;
Copper
;
Interconnects
;
On-chip
;
Statistics
;
Parallel computing
刊名:Computational Materials Science
出版年:2016
7.
Oxidation behavior of Cu-doped MnCo
2
O
4
spinel coating on ferritic stainless steels for solid oxide fuel cell
interconnects
作者:
Jinhua Xiao
a
;
Wenying Zhang
b
;
Chunyan Xiong
a
;
Bo Chi
a
;
chibo@hust.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Jian Pu
a
;
Li Jian
a
关键词:
Solid oxide fuel cell
;
Alloy interconnect
;
Copper
doped manganese cobaltite spinel
;
Long-term oxidation
;
Area specific resistance
刊名:International Journal of Hydrogen Energy
出版年:2016
8.
Feasibility study on the use of Cu(Co) alloy for barrierless
copper
metallization
作者:
Cao Fei
;
caofei1982@yahoo.com" class="auth_mail" title="E-mail the corresponding author
;
caofei@hrbeu.edu.cn" class="auth_mail" title="E-mail the corresponding author
;
Wu Gao-hui
;
Jiang Long-tao
;
Chen Guo-qin
关键词:
Cu(Co) alloy
;
Metallization
;
Barrier-free
;
Diffusion
刊名:Thin Solid Films
出版年:2016
9.
Copper
Iron Conversion Coating for Solid Oxide Fuel Cell
Interconnects
作者:
Jan Gustav Grolig
;
Jan.grolig@chalmers.se" class="auth_mail" title="E-mail the corresponding author
;
Patrik Alnegren
;
Jan Froitzheim
;
Jan-Erik Svensson
关键词:
Interconnect
;
Corrosion
;
Chromium volatilization
;
Sanergy HT
;
SOFC
;
Area specific resistance
刊名:Journal of Power Sources
出版年:2015
10.
Fabrication and characterization of
copper
interconnects
of line-width down to 100 nm using a specially designed phase shift mask
作者:
Arijit Roy
关键词:
Alternating phase shift mask
;
Copper
interconnects
;
Damascene
;
Integration process
;
Fabrication
刊名:Microelectronic Engineering
出版年:January, 2014
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